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无铅测试和检测

行业挑战

无论您是否已经准备好了,全球的印刷电路板(PCB)制造业都正在面临着必须向无铅工艺转变的巨大变革。 自 2006 年 7 月 1日起,根据有关法规,凡是在欧洲和中国大陆出售的印刷电路板组件(PCBA)都必须 100% 无铅。 

这两大市场的比重以及制造业的全球化本质意味着几乎所有的 PCBA 制造商都要在两年内转换到无铅工艺。 但这种转换将不会那么彻底:一些产品得到豁免可以超出 2006 年的底线;一些产品在未来的几年内,有铅和无铅将会并存;还有一些元器件很快就可以实现无铅。

向无铅工艺的转变为 PCBA 制造带来了难题包括:潜在的更高级缺陷、缺陷频谱偏移,以及由更高温度造成的可允许维修尝试次数的减少。 Keysight PCB 测试和检测系列专门针对无铅制造,可解决这些问题和其他更多问题。

总结

是德已准备就绪的无铅工艺解决方案可最大限度地降低向无铅工艺转变的风险

没有人能在这个转变过程中高枕无忧,但是利用是德的三大主要优势,您能够降低 PCBA 测试和检测方面的风险:

  • 端到端测试范围

只有是德可提供完整的测试组合,包括焊膏检测、自动光检测(AOI)、自动 X 射线测试、在线测试(ICT)和功能测试。 

已为当今的无铅工艺做好准备
长期以来,是德一直为那些开发新的无铅合金和熔剂系统、制造系统、软件和方法的行业领导者提供支持。 是德测试和检测解决方案已经过了实际客户的多年验证,并早已被世界各地的制造商用于无铅工艺之中。 

  • 专业技术

是德工程师了解无铅制造和测试战略,知道如何使两者互为补充。 是德能够为成功实施无铅测试战略提供信息、知识和指导,确保您能够创建一套完整的无铅工艺。

如欲了解更多信息,请查看其他产品信息

是德合作伙伴通过测试解决方案,能够帮助您获得最佳的测试结果。 查看电子制造业务的渠道合作伙伴和解决方案提供商名单。

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1-15 / 15

排序:
“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

应用说明 2015-07-14

PDF PDF 99 KB
Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.

文章 2005-12-05

PDF PDF 88 KB
Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

文章 2005-12-05

PDF PDF 57 KB
Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.

文章 2005-12-05

PDF PDF 77 KB
Characterizing new soldering processes – An experimental methodology for process optimization
Written by Glen Leinbach and Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, July 2005

文章 2005-12-05

PDF PDF 65 KB
Putting Pb-Free to the Test - Why AOI and SPI are vital to upfront process control and verification.
Written by Stig Oresjo, Thorsten Niermeyer & Stacy Johnson, Agilent Technologies. Article published in Circuits Assembly, May 2005.

文章 2005-12-05

PDF PDF 74 KB
Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

文章 2005-12-05

PDF PDF 75 KB
Lead-Free Cost Savings Analysis
This cost-savings calculator shows savings when deploying test on lead-free, as well as VTEP cost savings when compared to TestJet.

应用说明 2005-09-09

XLS XLS 39 KB
Study and Recommendations Into Using Lead Free PCBs at In-Circuit Test
ICT relies on good contact between the test probe and test pad. On OSP boards, it is important that the stencil allows solder paste to be applied to testpoints.

促销资料 2005-06-09

PDF PDF 214 KB
Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Keysight Medalist Family of test and inspection systems.

案例分析 2005-03-14

WMF WMF 19.21 MB
Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

应用说明 2005-02-22

PDF PDF 421 KB
Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

文章 2004-10-01

The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

应用说明 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

应用说明 2004-08-08

PDF PDF 102 KB
CCGA Lead-Free Study
Reliability Testing and Data Analysis of an 1657CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards).

促销资料 2004-06-04

PDF PDF 480 KB