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In-circuit test Systems - More than 30 years of Leadership
Keysight in-circuit test (ICT) solutions uphold the innovative spirit of bringing you technology for tomorrow's board test challenges. With over 30 years of ICT expertise, we continue to lead the industry with innovations that preserve your investments, even those from HP and Agilent days!
Electronics manufacturers for 5G, the internet of things (IoT), and the automotive and energy industries operate in a highly complex, globally-connected manufacturing environment. As manufacturing operations evolve, they require test systems that can provide high throughput, consistent and repeatable results to leverage the benefits of a "smart factory" environment in Industry 4.0.
At Keysight, we provide leading board test solutions for electronics manufacturers to address a wide range of Printed Circuit Board Assembly (PCBA) test access and coverage issues for today's complex printed circuit assemblies. We are pleased to introduce the i3070, an unparallel, in-line, and offline tester with a faster silicon nail and boundary-scan feature that increases test speed by up to 40%, and the i7090, the world's first 20 core parallel tester
Keysight's i3070 Series 6 ICT supports a wide range of PCBA sizes for IoT, 5G, automotive, and energy applications. The unique design of i3070 minimizes undesired effects from parasitic capacitance, improves immunity to crosstalk, and eliminates stray signal coupling, resulting in a much consistent and repeatable measurement.
Whether it's high-speed or high-power devices on increasingly miniaturized PCBAs that give you little test accessibility, or the growing popularity of flexible PCBx that introduce their own set of challenges, you can rely on Keysight to be your board and functional test partner from design to manufacturing.
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System Uptime Support Services
Automated ICT Systems
i1000 In-Circuit Test Systems
In-circuit Test > i3070 Systems
3070AF ICT i3070 Accessories
x1149 Boundary Scan Analyzer
i7090 Massively Parallel Board Test System
nanoVTEP Vectorless Test Applications
Utility Card: Flash Programming Applications
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In-Circuit Test Suite
Application Notes 2020.07.13
New i3070 Series 6 is 1.5x faster!
Application Notes 2021.06.07
Vectorless Test: nanoVTEP vs VTEP
Technical Overviews 2017.11.30
Electronic Components Tolerance and Test Limits for In-Circuit Test
Application Notes 2019.06.17
Reducing Downtime Remotely with Keysight On-Site Now!
Application Notes 2023.05.04
Plug and Play i3070 In-Circuit Tester into your Industry 4.0 Smart Factory using IPC-CFX
Article Reprints 2017.05.07
Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy
Technical Overviews 2014.07.30
Electronic Manufacturing Test Cooperative Support Service for Self-Maintainers
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Faster Time-to-Market Products with DFT Enablement
Common High-Speed PCBA Design Challenges
Signal integrity issues in high-speed PCB design become more common as device operating frequency increases. While high-speed simulation and interconnection tools can help designers solve some problems, more experienced and industry-wide exchanges are required. This is a list of some of the more prevalent issues.
The growing complexity of high-speed PCBA Design
- Due to the impedance sensitivity of high-speed traces, it is not possible to add test probes.
- Without these test probes, it is impossible to conduct adequate testing of component interconnects.
- Electronics are becoming more complex, and PCBAs are shrinking in size.
- The growth of electronics complexity makes the PCBAs denser and reduces the room to add test access points.
- As consumers demand smaller and slimmer portable products, the demand for smaller silicon nodes also increases, cramming more Semicon technologies into the same sized IC package.
- Most integrated circuits (ICs) are now complex Systems-on-Chip. Non-intrusive silicon node testing at the PCBA level is critical for reducing No-Trouble-Found issues on these complex ICs.
Faster Time-to-Market with DFT Enablement
Design for Test (DFT) on printed circuit board assembly (PCBA) is a design step to ensure that the new product will achieve the high-quality product in reduced time by providing success of the product from the design stage to high volume manufacturing. The cycle-time reductions are the result of designed-in testability, which eliminates iterative redesigns resulting from poor design practices.
Emerging technologies are continuously evolving from 5G to 6G, Internet of Things, Autonomous Vehicle, Artificial Intelligence (AI), and Virtual Reality (VR). All of this presents a challenge during the design and manufacturing testing stages, especially in ensuring the high test coverage for the ever-changing miniaturization of PCBAs.
Refer to the Application Note below for more information on achieving testability on today's complex PCBAs.
Application Note: IEEE 1687 – Silicon Test to Board Test
EXTEND YOUR CAPABILITIES WITH THE RIGHT TOOLS
The Keysight Board test system software is feature-rich and explicitly designed for PCBA Manufacturing Test. These tools ensure the success of Boundary Scan testing at all stages of the product life cycle, from design to prototyping, NPI, and high volume production runs.
DFT Analysis Tool
DFT analysis tool is available as part of the x1149 SW. This tool provides insights into how well the DFT on the PCBA is performing in terms of ensuring high test coverage. Below is the link to the software application.
Keysight x1149 Boundary Scan Analyzer Software Release
ICT is the most commonly used board manufacturing test in the manufacturing production line. To see what kind of test coverage you can get, click on the link below to download the i3070 ICT Software.
Keysight i3070 Software Release