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Pinpoint interference with post-processing spectrum management software in the lab.
Use this selector tool to quickly identify the best power supply for your aerospace and defense ATE requirements.
3D Interconnect Designer provides a flexible modeling and optimization environment for any advanced interconnect structure, including chiplets, stacked die, packages, and PCBs.
Get faster digital validation for less with a trade-in.
Emulate every part of your data center infrastructure. Emulate Anything. Optimize Everything.
With extra memory and storage, these enhanced NPBs run Keysight's AI security and performance monitoring software and AI stack.
Achieve fast, accurate board-level testing with robust inline and offline ICT designed for modern manufacturing.
Explore curated support plans, prioritized to keep you innovating at speed.
Authoritative application notes, data sheets, reference designs, and test procedures to accelerate design and validation decisions.
Hands‑on bootcamps that teach system design, test methods, and production workflows engineers can apply immediately.
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HeatWave 是適用於晶片、晶片堆疊 SiP 的 IC 熱模擬軟體， 可用元件和導線的空間解析度來計算整個晶片的溫度分佈，並將這些資料註解到您的電路模擬軟體中，讓您的模擬結果達到溫度準確的狀態。 由於晶片中熱源和熱傳導路徑的幾何特徵是次微米刻度，因此熱模擬和數值求解技術必須與該刻度相稱。 模擬結果為 3D 溫度分佈，並具有必要的解析度和準確度。
HeatWave 電熱分析軟體有兩種配置可以選擇；您可依照需要分析的類型（穩態或是暫態熱分析）以及待模擬設計的複雜度（元件數量，例如進行模擬時被當作熱源的電晶體），來決定選擇哪一種配置。
W2590ET HeatWave 電熱模擬軟體包含暫態和穩態熱求解器，可與協力廠商的電路模擬軟體結合使用，另外還提供可將 3D 熱分析結果視覺化的操作介面。 高效能暫態求解器可執行溫度隨時間變化的分析。
