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Highlights
Innovative solutions for identifying wire bond defects
The Keysight electrical structural tester is a capacitive-based testing solution designed to identify wire bond defects accurately. Leveraging the advanced part average test (PAT) analysis, the tester establishes a baseline from known-good units to swiftly detect deviations like near-shorts, stray wires, wire sweeps, and sags within integrated circuits (ICs). This capability ensures robust product quality management and significantly enhances manufacturing efficiency. The electrical structural tester enables you to:
- Test single-die wire bonded packages in singulated or strip-based form factor.
- Achieve high-volume production with up to 20 parallel test sites, achieving up to 72,000 IC units per hour (UPH).
- Enhance yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT) and real-time part averaging test (RPAT).
Catch Wire Bond Defects Like Never Before
Top Stories and Key Events
Carol Leh Discusses New Wire Bond Testing in SEMICON Taiwan Interview
Carol Leh, Senior Vice President of EISG, discussed why the Electrical Structural Tester marks a significant breakthrough for wire bond testing in the microelectronics industry during a featured interview with DIGITIMES. Watch the video to learn more.
How the Electrical Structural Tester Will Transform Wire Bond Testing: EE Times Asia Interview
In a featured interview by EE Times Asia, one of the Keysight representative explains how the Electrical Structural Tester will transform the wire bond testing industry. Watch the video or read the full story to learn more.
Spotting deviations with PAT
The electrical structural tester part average test (PAT) algorithm plays a crucial role in identifying abnormal wire bond variations that may indicate electrical or nonelectrical defects in ICs. The part average test uses continuous statistical analysis to monitor the production process, detecting deviations in part characteristics. The test employs dynamic PAT for strip testing and real-time PAT for singulated packages, ensuring the baseline of known good units for devices under test (DUTs) remains updated. This optimization adjusts test limits to minimize false rejects and scraps, reducing the need for retesting.
Capacitive Wire Bond Testing
The electrical structural tester brings cutting-edge wire bond testing with its Keysight vectorless test enhanced probe (VTEP) technology. This innovative approach uses capacitive coupling between metallic surfaces, such as wire bonds in an IC and a sensor plate above them. By injecting a stimulus through guard pins to reach the wire bond, the VTEP amplifier contacts the sensor plate, completing the circuit and capturing the coupling response. This process precisely pinpoints the wire bond's position beneath the metallic surface.
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Extend the Capabilities of Your Electrical Structural Tester
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