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3D Interconnect Designer Software
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是德建議使用最新的版本，其中包括最新的漏洞修復與安全覆蓋
| 發佈日期 | 版本 | 版本說明 |
|---|---|---|
| 2026-04-15 | 2026 | First release of 3D Interconnect Designer: This new solution introduces a powerful environment for designing, visualizing, and analyzing complex 3D interconnect structures across advanced packaging and heterogeneous integration technologies. Built with performance and usability in mind, 3D Interconnect Designer enables engineers to explore and validate designs before detailed implementation—helping reduce design risk and accelerate the development of next-generation electronic systems. |
| 發佈日期 | 版本 |
|---|---|
| 2026-04-15 | 2026 |
| 版本說明 |
|---|
| First release of 3D Interconnect Designer: This new solution introduces a powerful environment for designing, visualizing, and analyzing complex 3D interconnect structures across advanced packaging and heterogeneous integration technologies. Built with performance and usability in mind, 3D Interconnect Designer enables engineers to explore and validate designs before detailed implementation—helping reduce design risk and accelerate the development of next-generation electronic systems. |
Note: Licenses (>=2026.02) are required for this release. If you are a supported customer, login to the Keysight Software Manager to obtain your updated licenses before installation. For other licensing tasks, see How to Obtain a License.
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- Win 11
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