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Pathwave test software

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PathWave Manufacturing Analytics
Model
PM2288A

Use PM2288A PathWave Manufacturing Analytics to drive manufacturing improvements with an Industry 4.0 electronics data analytics solution.

Image of  TestExec SL Software
TestExec SL Software
Model
E2011GC

TestExec SL is a highly flexible test executive software for electronics manufacturing functional test applications in multiple industries.

Image of  PathWave Test Executive for Manufacturing Developer Version
PathWave Test Executive for Manufacturing Developer Version
Model
KS8328A

KS8328A PathWave Test Executive for Manufacturing operates on TAP, fast track automated test plan creation to reduce development time and enhance user experience.

Image of KS8328A PathWave Test Executive for Manufacturing operates on TAP
Model
KS8329A

Deploy test plans created with PathWave Test Executive for Manufacturing, deployment and developer licenses provide flexibility in managing cost of test.

Image of  TestExec SL Software
TestExec SL Software
Model
E2011GH

TestExec SL is a highly flexible test executive software for electronics manufacturing functional test applications in multiple industries.

Image of  1149.1 Boundary Scan Feature, GTE 10.00p
1149.1 Boundary Scan Feature, GTE 10.00p
Model
K8212A

Boundary scan is a method for testing interconnections on printed circuit boards. Keysight’s Interconnect Plus Boundary Scan feature enables all the tools required to develop and execute this foundational test method on the board under test.

Image of  1149.1 Boundary Scan Feature, GTE 10.00p
1149.1 Boundary Scan Feature, GTE 10.00p
Model
K8212B

Boundary scan is a method for testing interconnections on printed circuit boards. Keysight’s Interconnect Plus Boundary Scan feature enables all the tools required to develop and execute this foundational test method on the board under test.

Image of  1149.6 Boundary Scan Feature, GTE 10.00p
1149.6 Boundary Scan Feature, GTE 10.00p
Model
K8213A

Keysight’s Interconnect Plus Boundary Scan 1149.6 feature enables all the tools required to develop and execute this test method on the board under test. Compared to the 1149.1 standards, the 1149.6 standards define test methods for the boundary scan devices that are designed with AC coupled signals or differential nets needed for high-speed operations of the device.

Image of  1149.6 Boundary Scan Feature, GTE 10.00p
1149.6 Boundary Scan Feature, GTE 10.00p
Model
K8213B

Keysight’s Interconnect Plus Boundary Scan 1149.6 feature enables all the tools required to develop and execute this test method on the board under test. Compared to the 1149.1 standards, the 1149.6 standards define test methods for the boundary scan devices that are designed with AC coupled signals or differential nets needed for high-speed operations of the device.

Image of  Silicon Nails Feature, GTE 10.00p
Silicon Nails Feature, GTE 10.00p
Model
K8214A

Keysight’s Silicon Nails feature enables all the tools required to develop and execute tests on non-compliant boundary scan devices that are connected to boundary scan compliant devices on the printed circuit board.

Image of  Silicon Nails Feature, GTE 10.00p
Silicon Nails Feature, GTE 10.00p
Model
K8214B

Keysight’s Silicon Nails feature enables all the tools required to develop and execute tests on non-compliant boundary scan devices that are connected to boundary scan compliant devices on the printed circuit board.

Image of  Advanced Throughput Multiplier Feature, GTE 10.00p
Advanced Throughput Multiplier Feature, GTE 10.00p
Model
K8215A

The Advanced Throughput Multiplier feature allows you to test up to two 1000 to 2000 node (between 1296 and 2592 nodes) boards simultaneously on a 4 module tester, thus dividing the test time by half.

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