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Explore dual-channel and ultra-wideband signal analysis for demanding RF workflows.
Get faster, clearer insights with our new multicore, 12-bit oscilloscope up to 33 GHz. Trade in your old oscilloscope and get credit toward a new XR8.
Bridging design and physical testing to evaluate drop, impact, shock, and vibration compliance before hardware exists.
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Strengthen 1.6T network reliability for AI-scale workloads from transceivers to interconnects.
Pair Keysight VSA software with the new XA5 signal analyzer for advanced visualization, demodulation, and analysis — start your 30-day trial today.
With extra memory and storage, these enhanced NPBs run Keysight's AI security and performance monitoring software and AI stack.
Explore end-to-end workflows spanning IC design, validation, wafer test, and photonics.
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Explore methodologies, test strategies, and technical resources for designing, validating, and scaling AI systems and networks.
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W8608EP 模型建構軟體（MBP）UTSOI 模型產生要件是適用於 Leti-UTSOI 的自動基頻模型萃取軟體套件。此萃取軟體套件具備下列特性：
Leti-UTSOI 輕巧模型由 CEA-Leti 所開發，可用於描述 FDSOI 電晶體的電氣特性，並將其所有的特異性都考慮在內。該模型根據對元件的實體描述，其所有參數皆以實體為基礎，因而可用於對處理過程進行預測性分析。模型中考慮到了薄矽膜前後介面之間的靜電耦合，因此可準確呈現採用低摻雜薄矽膜技術的元件特性，包括絕緣層厚度從幾奈米到幾百微米的元件。 在最新版本（2.x）中，Leti-UTSOI 輕巧模型加入了在矽膜背面建立反轉層的完整描述。這個實體描述是透過求解電晶體中主導靜電的方程式，並根據其未經簡化的原始解而獲得的。Leti-UTSOI 模型是第一個，也是目前唯一具有此功能的輕巧模型，因此能夠描述在電晶體前後介面上應用大範圍極化時的電晶體特性。2019 年 4 月，UTSOI2 已進入 FDSOI technology 輕巧模型聯盟（CMC）標準化過程的第二階段。 回到 Model Builder Program (MBP) 頁面。
