3D Interconnect Designer 2026 U1 Highlights

Product Tours

Explore what’s new in Keysight 3D Interconnect Designer 2026 Update 1 for advanced 2.5D and 3D package design.

 

This release expands support for complex heterogeneous integration, improves physical modeling and routing accuracy, and adds new capabilities for design productivity, analysis, and automation.

 

Key updates include:

  • Support for TSVs, Copper Pillars, Hybrid Bonding, and staggered via structures
  • New HBM and UCIe-3D templates for faster package creation
  • Enhanced bump map editing and 3D visualization
  • Automatic teardrop generation and copper surface roughness models
  • Crosstalk analysis for 3D interconnects
  • Beta export of component layouts to ADS Layout and GDSII
  • Improved Ground Line, simulation, and scripting workflows
  • MCP server support for integration with AI assistants and external automation frameworks
  • Stability, usability, visualization, and performance improvements

 

3D Interconnect Designer 2026 Update 1 helps engineers build and evaluate increasingly complex advanced package architectures with improved model fidelity, more efficient design workflows, and greater automation.

 

Image for W9100E 3D Interconnect Designer - Standalone Version

Software

W9100E 3D Interconnect Designer - Standalone Version

The 3D Interconnect Designer enables engineers to create detailed models of interposers, microbumps, vias, and multi-die interconnect structures for early system validation and performance optimization.