1GG7-4257 DC - 26.5 GHz SPDT GaAs Packaged MMIC Switch

Keysight 1GG7-4257

DC - 26.5 GHz SPDT GaAs Packaged MMIC Switch

Data Sheet

• Outputs terminated in 50 Ω when off
• Frequency range: DC to 26.5 GHz
• Insertion loss: 2.5 dB @ 26.5 GHz
• Isolation:
• > 70 dB @ 45 MHz
• 30 dB @ 26.5 GHz
• Return loss: 15 dB (both input & selected output) 12 dB unselected output
• Switching speed: < 1 ns (10% to 90% RF)
• P-1 dB:
• 18 dBm @ 10 MHz
• 27 dBm @ 2 GHz
• Harmonics (DC coupled):
• < -45 dBc @ 10 MHz & 5 dBm
• < -65 dBc @ 2 GHz & 5 dBm

Description

The 1GG7-4257 is a GaAs monolithic microwave integrated circuit (MMIC) packaged in a 2 x 2 mm, 12 lead QFN. The switch is designed for low insertion loss and high isolation from DC to 26.5 GHz. It is intended for use as a general–purpose, singlepole, double– throw (SPDT), absorptive switch. Two series and two shunt MESFETs per throw provide 3 dB maximum insertion loss and 30 dB minimum isolation at 26.5 GHz.

Applications

The 1GG7-4257 can be used in instrumentation, communications, radar, ECM, EW, and many other systems requiring SPDT switching. It can be used for pulse modulation, port isolation, transfer switching, highspeed switching, replacement of mechanical switches, and so on.

Recommended operating conditions

(Note: Isolating the RF IN port from DC ground with a blocking capacitor will result in non-zero DC potential at that port in its off-state, which can cause undesirable slow settling phenomenon in the reflection characteristic of that port in its off-state. In this case, a DC path to ground should be provided on the RF IN port to accommodate leakage current from the FETs.)

The 1GG7-4257 die is fabricated using a GaAs-based FET semiconductor material structure which is compatible with newer RoHS assembly temperatures and allows the device to be attached to a hybrid microcircuit housing or to thermally conductive embedded heatsinks which exist in QFN SMT Packages.

Moisture Compatibility

Injection mold components like the 1GG7-4257 in QFN are moisture-sensitive. The product is tested to the moisture and reflow sensitivity level 5A as per IPC/Jedec J-STD-020 and must be mounted within 24 hours of opening the shipping container.

RoHS Compliance

This part is RoHS compliant, meeting the requirements of the EU Restriction of Hazardous Substances Directive 2011/65/EU, commonly known as RoHS. Six substances are regulated: lead, mercury, cadmium, chromium VI (hexavalent chromium), polybrominated biphenyls (PBB), and polybrominated biphenyl ethers (PBDE). RoHS compliance requires that any residual concentration of these substances is below the Directive’s maximum concentration values (MCV): cadmium 100 ppm by weight and all others 1000 ppm by weight.

ESD and Handling Precautions

GaAs MMICs in either chip or SMT packages are ESD sensitive. ESD preventive measures must be employed in all aspects of storage, handling, and assembly. MMIC ESD precautions, handling considerations, die attach and bonding methods are critical factors in successful GaAs MMIC performance and reliability. Keysight application note, GaAs MMIC ESD, Die Attach and Bonding Guidelines (5991-3484EN) provides basic information on these subjects.