Choose a country or area to see content specific to your location
アプリケーションノート
Progress of semiconductor devices has rapidly accelerated toward high integration, high density and high functionality. In addition, use applications are widely penetrated into various consumer and industrial ields.
Failure analysis is the process of investigating semiconductor devices after failure is observed by electric measurement, and by physical, microscopy and chemical analysis techniques necessary to conirm the reported failure and clarify the failure mechanism. It relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods. The NDT (nondestructive testing) methods are valuable because the failed products are unaffected by analysis, so inspection usually starts using these methods. “Microelectronics Failure Analysis Desk Reference” 5th edition published by ASM International is a good reference which covers the plethora of techniques employed in semiconductor failure analysis.
コンテンツのロックを解除する
無料でお申し込み頂けます
*Indicates required field
ありがとうございました。
フォームが送信されました。
Note: Clearing your browser cache will reset your access. To regain access to the content, simply sign up again.
×
営業担当者からご連絡させていただきます。
*Indicates required field
ありがとうございました。
A sales representative will contact you soon.