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The pandemic has shifted many digital modernization projects within the internet infrastructure to occur more swiftly. Similar to the way cloud architectures have changed networking in the past decade, we now see rapid transitions to new technologies. In the next 2-3 years the future ethernet speed will evolve toward the 224 Gbps per lane. Consider, at this serial data rate, transition times are about 4 picoseconds and unit intervals are below 10 picoseconds for PAM-4 modulation. The development of a reliable end-to-end copper communications channel require careful examination of semiconductor devices, packages, PCBs, connectors, and cable assemblies within this context.
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