The ADS Core, TransConv, Channel, IT, Layout, SIPro Bundle is recommended for:
Hardware product designers and SI engineers with a focus on high-speed serial links
The ADS Core, TransConv, Channel, IT, Layout, SIPro Bundle functionality is shown in the table below.
Functionality in this Bundle
Model Number
Name
Description
W2200BP
ADS Core
Provides essential RF and microwave design capabilities in a highly productive enterprise schematic design environment. Fast linear simulation, comprehensive filter and passive circuit synthesis.
W2302EP
Transient Convolution and Channel Simulation Element
Advanced time-domain Element that includes Transient Simulator (SPICE transient analysis including HSPICE and Spectre compatibility modes), IBIS Model Library, Convolution Simulator (creates time-domain models from frequency domain data), Channel Simulator (includes bit-by-bit and statistical modes, eye diagrams and BER contours, IBIS AMI).
W2307EP
Interconnect Toolbox Element
The Interconnect Toolbox Element enables you to optimize your PCB stack up and design transmission line geometry. It also provides a high accuracy via design simulator which helps you to design a parameterized, impedance-matched via transition (single-ended and differential).
W2321EP
Layout Element
Comprehensive physical design environment specifically geared for high-frequency circuit development, including artwork import/export for ODB++, DXF, Gerber/drill, IGES and GDS-II formats.
W2360EP
SIPro Signal Integrity EM Analysis Element
SIPro provides signal integrity (SI) analysis of complex high-speed PCBs, enabling you to characterize loss and coupling of signal nets, and ultimately extract an EM-accurate model that can be used in the ADS Transient and Channel Simulators.
To learn more about the products listed in the table above, click the Options & Accessories tab above to view Related Software Products.
