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utions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:models/e9/e9988gl,keysight:models/b2/b2912csegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/high-speed-digital,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:models/e9/e9988gl,keysight:models/b2/b2912csegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/high-speed-digital,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:models/e9/e9988gl,keysight:models/b2/b2912c
Como realizar medições precisas de baixa corrente
Meça correntes ultrabaixas em sistemas eletrônicos automotivos utilizando automação de testes baseada em ICT e SMU para uma análise precisa das correntes de fuga e de modo de espera.
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