Solving 3D Module Integration Challenges for RF Circuit Designs
  • Cursos
  • 6 Itens

This paper and demonstration will explore the assembly, integration, and Circuit-EM validation of a typical dual-band smartphone Front-End Module (FEM) in ADS using the latest innovations in the SmartMount and RFPro software elements.  

 

Learn:

• How wireless transceiver designers must integrate RFIC and MMIC components, switches, matching networks and 3D components into densely packed LTCC modules. 

• How these designs concentrate a variety of challenges into very small spaces, requiring various technologies and co-design workflows. 

• How the FEM, Momentum, and Electro-Thermal simulators, as well as the Layout Connectivity and Layout Verification tools such as LVS, DRC, and ERC that are needed to fabricate physical designs with full confidence.   

Lessons
Lesson 1 - Solving 3D Module Integration Challenges for High-Performance Microwave Design

Lesson 1 - Solving 3D Module Integration Challenges for High-Performance Microwave Design

This paper and demonstration will explore the assembly, integration, and Circuit-EM validation of a typical dual-band smartphone Front-End Module (FEM) in ADS using the latest innovations in the SmartMount and RFPro software elements.

Identify RF coupling issues early with EM/Circuit Co-Simulation

Aprenda

Identify RF coupling issues early with EM/Circuit Co-Simulation

Learn how mixed microwave and mmWave designs now integrate MMIC, RFIC, laminate, and antennas together in a compact form factor. See how to resolve RF coupling issues.
Four Secrets to Mastering Millimeter-Wave Communications Circuit Design

eBooks

Four Secrets to Mastering Millimeter-Wave Communications Circuit Design

In this eBook, you will learn four EDA secrets to mastering mmWave communications circuit design and how to streamline your design workflow to achieve first-pass success. We will cover assembly and EM / circuit co-simulation of RF modules, designing for digitally modulated RF signals, and guaranteeing nonlinear amplifier stability modulated in a multi-technology 3D structure.

RFPro Technical Overview

Visão Geral Técnica

RFPro Technical Overview

This is an overview of RFPro, an EM (electromagnetic) design environment for RF circuit designers. It automates EMCircuit co-simulation to account for EM effects on RF circuit performance in 3D IC layouts, packaging, interconnects, transitions, and PCB boards. RFPro enables interactive access to EM analysis for tuning and optimization of RF circuits during design just like circuit simulators.
Menlo Micro - Driving Innovation Shortens Design Cycle

Case Studies

Menlo Micro - Driving Innovation Shortens Design Cycle

Menlo Micro is using RFPro for 3D EM–circuit co-simulation in ADS to accelerate design and verification and solve meshing issues. RFPro features a mesh domain optimization capability for the finite element method to automatically decrease the simulation space when selecting nets or components while keeping an accurate ground return path.
Request a Free ADS Trial

Request a Free ADS Trial

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W3608B ADS Core, EM Design, Layout, RFPro, RF Ckt Sim, Sys-Ckt Verification, Complete VTBs

ADS and EM design environments with 3D RF layout for multi-technology RF module design and module level DRC/LVS/LVL verification for error-free assembly.
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