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DesignCon 2026
Accelerating AI innovation at the interconnect
Stop by booth #1039 to see how Keysight helps teams accelerate AI innovation by validating next-gen interconnects faster with greater power efficiency. As speeds climb from 800G to 3.2T and chiplet-based 3D architectures add complexity, faster insight is critical to debug early and sign off with confidence. Explore live demonstrations of 3.2T pathfinding, 1.6T interconnect validation, chiplet and 3D IC workflows, PCIe® Gen7 debug, and DDR / LPDDR testing up to 50 GHz.
Book a one-on-one meeting with a Keysight expert to discuss your 2026 goals and toughest validation challenges.
Explore the demos below and plan your booth route.
DATE
February 24 – 26, 2026
LOCATION
Santa Clara Convention Center
Santa Clara, California
KEYSIGHT BOOTH
1039
Eight Live Demos. Pick Your Focus. Get Answers.
See them live February 25–26 at Booth #1039
Keysight Education Forum
Ballroom K
Wednesday, February 25, Sessions
Channel Simulation and EOE. One Flow
8:30 to 9:15 a.m.
9:20 to 10:00 a.m.
11:00 to 1:40 a.m.
PCIe®, Increasing Data Rate and the Channel's performance with Optical Links11:50 a.m. to 12:30 p.m..
1:30 to 2:10 p.m.
2:20 to 3:00 p.m.
Conference Papers from Keysight
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