Stop by booth #1039 to see how Keysight helps teams accelerate AI innovation by validating next-gen interconnects faster with greater power efficiency. As speeds climb from 800G to 3.2T and chiplet-based 3D architectures add complexity, faster insight is critical to debug early and sign off with confidence. Explore live demonstrations of 3.2T pathfinding, 1.6T interconnect validation, chiplet and 3D IC workflows, PCIe® Gen7 debug, and DDR / LPDDR testing up to 50 GHz.

Book a one-on-one meeting with a Keysight expert to discuss your 2026 goals and toughest validation challenges.

Explore the demos below and plan your booth route.

DATE
February 24 – 26, 2026

LOCATION
Santa Clara Convention Center
Santa Clara, California

KEYSIGHT BOOTH
1039

Eight Live Demos. Pick Your Focus. Get Answers.

See them live February 25–26 at Booth #1039

Designing the Future of AI with Chiplet 3D Interconnect Designer

Accelerate 3D interconnect design for chiplet-based architectures with workflows to model hatched ground planes, optimize 3D interconnects, and simulate SI bridge / interposer behavior early in the design cycle. See it in action with W3510E to reduce risk and speed decisions before tapeout.

Ensuring Signal Integrity at 3.2T Speeds

Get to confident 3.2T signal integrity faster with measurement workflows that shorten time to market. Sweep up to 170 / 250 GHz with a 4-port VNA, generate PAM4 / 6 / 8 eye diagrams, and accelerate iteration with batched AFR enhancements. See it with N5247B, N5292A, NA5307A, 85065A, and N19301B.

Validating Next-Gen Memory for AI Workloads

Bring up new DDR / LPDDR silicon faster with workflows to validate early, probe up to 50 GHz, and optimize signal margin for cleaner compliance and debug. See it in action with D9060LDDC and the LPDDR6 Tx Compliance App.

Reliable PCIe® PAM4 Performance for AI Acceleration

Validate PCIe® Gen7 PAM4 Tx / Rx performance with workflows built for reliable bring-up and faster debug. Maximize DUT margins, pinpoint link issues sooner, and strengthen PCIe® reliability as speeds climb. See it in action with M8199B (x2) and the N1000 + N1046 1 mm kit.

Driving Signal Integrity for AI: 448 Gbps Pathfinding

Push 448 Gbps pathfinding with workflows to generate PAM4 / 6 / 8 signals, analyze 3.2T-class systems, and optimize channel modulation choices faster. See it live with the UXR0902B 80 GHz scope, M8050A BERT, PCIe® transmitter analysis software (SW00PCIE / SW02PCIE), and PCIe® RX test software (N5991P).

Streamlining USB4 Compliance Testing for AI Systems

Speed USB4 compliance for AI systems with workflows that preserve signal integrity while enabling faster, smaller designs. Accelerate compliance testing, catch issues earlier, and move through bring-up with fewer iterations.

Benchmarking 1.6T Interconnects for AI Networks

Validate AI-scale interconnects with workflows to benchmark 1.6T links, measure link quality, and optimize workloads with clear performance data. See it live with INPT-1600GE traffic generation and BERT solutions including M8050A and FITS-8CH.

Validating UALink and Scale-Up Ethernet for AI Infrastructure

Automate compliance and interoperability for AI-scale links with workflows to validate 1.6T speeds, run multi-layer interop tests, and reduce manual effort through automation. See it in action with N1092 / UXR oscilloscopes, compliance software suites (Ethernet 1.6T, PCIe® Gen6 / 7, CEI-112 / 224), and the high-speed test ecosystem including fixtures and probes.

Keysight Education Forum

Ballroom K

Conference Papers from Keysight

Date

Start time

Session title

Presenter(s)

Room

Tuesday, February 24 2:00 p.m. Tutorial – Calibrate It Right or Measure It Wrong! Master Class on 2-Port Impedance Measurement Calibration for PDN Components Heidi Barnes and contributors Ballroom G
Tuesday, February 24 2:00 p.m. Tutorial – Understanding the Viterbi Decoder David Banas Ballroom A
Wednesday, February 25 9:00 a.m. Methods to Model and Measure Noise Mitigation with Embedded Capacitors in High-Current PDNs for AI and Cloud Compute Applications Heidi Barnes / Kalyan Rapolu and contributors Ballroom C
Wednesday, February 25 2:00 p.m. Modeling and Measuring Large Signal PDN Crosstalk and Ground Bounce with a Multi-Phase VRM System Using a Fast Multi-Domain BGA Step Load Heidi Barnes and contributors Ballroom B
Wednesday, February 25 2:00 p.m. IBIS-AMI Modeling for Bi-directional D2D Links with Clock Forwarding and Echo Cancellation Fangyi Rao / David Banas Ballroom E
Wednesday, February 25 3:00 p.m. An Experimental Study of PCIe® Transmitter Equalization Preset Measurement Methods for 64 and 128 GT/s PAM4 Signaling Rick Eads and contributors Ballroom C
Wednesday, February 25 4:00 p.m. Panel – Powering the Future: AI’s Role in Next-Generation Power Integrity Solutions (Broad Aspirational) Heidi Barnes and contributors Ballroom E
Thursday, February 26 8:00 a.m. A Novel Off-Board Vertical Power Supply Solution Heidi Barnes / Xuguo Jiang and contributors Ballroom C
Thursday, February 26 8:00 a.m. Bridging the Gap Between Simulation and Measurement in DDR5: Techniques for Improved Correlation Randy White / SK Choi Ballroom E
Thursday, February 26 11:15 a.m. Practical Modeling of 3D Interconnects with Hatched Ground Planes in Silicon Interposers, Bridges, and Flex PCBs Tim Wang-Lee / Taejong Jeong and contributors Ballroom D
Thursday, February 26 3:00 p.m. Demonstration of an Electronic-Photonic Co-Design and Co-Simulation Flow for High-Speed Optical Communications Harold Devos, Jan Van Hese, Stefanos Andreou, Muhammed, Umar Khan and contributors Ballroom H
Thursday, February 26 4:45 p.m. Panel – Designing and Validating the Future: SERDES and Channel Innovations for PCIe® at 128 GT/s Pegah Alavi / Rick Eads Ballroom A

Join the DesignCon Conversation

At DesignCon 2026, share what stood out, what sparked ideas, and what’s next for AI innovation. Join the conversation using #KeysightDesignCon2026 on LinkedIn and Facebook.

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