How to Test High-Speed PCB Assemblies

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In-Circuit Test System
+ In-Circuit Test System
In-Circuit Test System
+ In-Circuit Test System

Testing High-Speed PCB Assemblies

As printed circuit board (PCB) designs evolve to support high-speed differential signaling and dense component integration, traditional in-circuit testing (ICT) faces significant limitations. Technologies such as low-voltage differential signaling (LVDS) and ball grid array (BGA) packages reduce physical test access, making it difficult to achieve full node coverage using conventional test points and fixtures.

Engineers must adopt new test methodologies that address limited access while maintaining fault coverage. Techniques such as boundary scan (IEEE 1149.6) and bead probe technology enable validation of high-speed interconnects and hidden nodes, ensuring reliable detection of opens, shorts, and signal integrity issues in complex PCB assemblies.

High-Speed PCB ICT Validation Solution

Testing high-speed PCB assemblies requires a combination of in-circuit techniques and advanced access methods to ensure thorough fault coverage despite limited physical test points. The Keysight i3070 in-circuit test system integrates traditional in-circuit testing with boundary scan and bead probing to address dense board designs. Engineers can validate high-speed differential signals, detect opens and shorts, and identify defects at the device pin level. By combining multiple test strategies, the system enables accurate diagnostics and reliable performance verification. Together, these capabilities help improve product quality, reduce test escapes, and optimize manufacturing efficiency for complex assemblies.
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