• LPDDR3 178-ball BGA interposer designed to exceed 1866Mb/s data rates. Provides connection to all address, command, control, DQSt and DQ between a U4164A logic analysis system and JEDEC standard 178- ball LPDDR3 DRAM
  • Provides access for DDR eye scans and burst scans of LPDDR3 signals
  • W3301A ships with a custom 178-ball LPDDR3 riser to reduce keep-out volume (KOV) under the interposer. (Riser can be replaced with optional 3rd party socket – not provided)
  • Works with all solder finishes and designed to tolerate lead-free soldering temperature profiles

Each W3301A LPDDR3 178-ball BGA interposer requires

  • U4164A logic analyzer module with Option U4164A-01G or U4164A-02G to capture DQ at higher data rates
  • Chassis for U4164A logic analyzer module(s) with controller or host PC
  • Two E5406A Soft Touch Pro probes and four U4201A cables (160-pin connect to logic analyzer front panel connector)
  • Default configuration obtained from B4661A memory analysis software standard tools installation(no charge for standard software tools and default configurations)

The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.

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