Comprehensive physical design environment for RF module, MMIC, RFIC and RF PCB with intelligent 3D multi-technology assembly & routing to create complex multi-chip integrated structures.. Module level DRC, LVS, LVL. Supports OA, ODB++, Gerber, GDSII, etc.

Highlights

The W3010E PathWave ADS Layout includes:

  • 3D multi-technology RF layout physical design, assembly and avoidance routing
  • Synchronized with ADS schematic for automatic distributed element layout generation
  • Module level multi-technology DRC, LVS and LVL
  • Supports OA, ODB++, Gerber, GDSII and other popular 2D/3D industry file formats

PathWave ADS Layout enables error-free assembly and 3D avoidance routing to interconnect RFICs, MMICs, laminates, wafer-level packaging, antennas, and PCBs into multi-technology RF modules. SmartMount enables drag-and-drop error-free assembly of mixed technology components into a simulate-able 3D structure by automatically taking care of layer stack up definitions, units and orientation. Module level DRC, LVS and LVL (Layout-vs-layout) works across multi-technology assemblies to ensure error-free construction. Supports OpenAccess, ODB++, GDSII, Gerber and other popular industry formats for 2D, 3D planar and full 3D imports of structures created in other tools for assembly and subsequent EM simulation.

Note: This element license requires a host bundle to work. For recommended bundle configurations, click here.

Amplie as Capacidades

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