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segmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-testsegmentation:business-unit/EISG,segmentation:funnel/mofu,segmentation:campaign/Automotive_Energy,keysight:models/q9/q9999a,keysight:product-lines/80,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/InCircuit_Test_Systems,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/design-and-test-product/board-test
MOL 테스트를 통해 택트 타임을 최적화하는 방법
점점 더 복잡해지는 프로그래밍, 바운더리 스캔, 기능 테스트 및 최종 라인 작업 전반에 걸쳐 택트 타임을 최적화하여 자동차용 PCBA 자동화 제조 테스트 라인의 균형을 맞춥니다. 이를 통해 택트 타임을 충족하도록 설계된 솔루션을 바탕으로 처리량을 높이고 생산 자원을 보다 효율적으로 활용할 수 있습니다.
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