Why Use Signal Integrity EM Professional (SIPro)
Built for modern high-speed digital standards.
Signal Integrity Professional (SIPro) is a post-layout EM (Electro-Magnetic) extraction tool for high-speed signal integrity applications. SIPro delivers user-friendly, fast, accurate signal integrity analysis for the most demanding high-speed digital designs, built to handle the complexity of high-end PCBs, advanced packaging, and high-speed interface systems. SIPro helps engineers identify issues earlier, optimize designs faster, and achieve first-pass success with confidence. SIPro provides the accuracy needed to predict real-world designs by leveraging high-fidelity electromagnetic while dramatically reducing simulation turnaround time. Engineers can quickly evaluate hundreds of channels, uncover signal integrity bottlenecks, and make design decisions with confidence across packages, PCBs, and complete high-speed digital systems. By combining speed, scalability, and trusted accuracy in an integrated workflow in ADS, SIPro enables design teams to accelerate product development, reduce costly respins, and bring next-generation systems to market faster.
Key Capabilities
Evaluate signal quality across complete communication channels.
Visualize margins and identify performance limitations.
Pinpoint reflections, crosstalk, and impedance discontinuities.
Analyze designs for modern digital standards.
Improve productivity with simulation-driven design decisions.
Assess signal integrity in advanced chiplet architectures.
Resources to Get You Started
Learn how to identify, analyze, and resolve signal integrity challenges in high-speed digital systems. The eBook explains how signals degrade across PCB traces, vias, connectors, and interconnects, and introduces a practical three-step process for evaluating digital channels. Readers will discover how eye diagrams, mixed-mode S-parameters, and time-domain reflectometry help diagnose signal degradation, determine root causes, and guide design improvements that reduce risk, maximize design margins, and improve overall system performance.
Bootcamps
Designing with Signal Integrity for Digital Standards
백서
Signal Integrity Fundamentals
레슨
Optimizing High-Speed Digital Interfaces
레슨
Signal Integrity Design Workflow Evolution - Episode 1
레슨
Electro-Magnetic Modeling of High-Speed Interconnects Using SIPro
Webinars
Designing a Robust Workflow for Signal Integrity
Webinars
Generating AMI Models for SerDes Designs
Explore Signal Integrity EM Professional (SIPro) Bundles
EDA software bundles provide designers with pre-configured combinations targeted to a specific design workflow.
PathWave ADS Core + EM Design + Layout + HSD Ckt Sim + SIPro
고속 직렬을 위한 레이아웃 후 EM 검증을 포함합니다. SIPro는 복잡한 고속 PCB에 대한 신호 무결성 분석을 제공하므로, 트랜션트 및 채널 시뮬레이터에서 사용할 수 있는 정확한 EM 모델을 추출할 수 있습니다.
고속 직렬을 위한 레이아웃 후 EM 검증을 포함합니다. SIPro는 복잡한 고속 PCB에 대한 신호 무결성 분석을 제공하므로, 트랜션트 및 채널 시뮬레이터에서 사용할 수 있는 정확한 EM 모델을 추출할 수 있습니다.
PathWave ADS Core, EM Design, Layout, HSD Ckt Sim, SIPro, PIPro
고속 직렬 신호 무결성 및 전력 무결성을 위한 레이아웃 후 EM 검증을 포함합니다.
고속 직렬 신호 무결성 및 전력 무결성을 위한 레이아웃 후 EM 검증을 포함합니다.
PathWave ADS Core, EM Design, Layout, HSD Ckt Sim, 메모리, SIPro, PIPro
고속 직렬, 메모리, 신호 무결성 및 전력 무결성을 위한 레이아웃 후 검증을 포함합니다.
고속 직렬, 메모리, 신호 무결성 및 전력 무결성을 위한 레이아웃 후 검증을 포함합니다.
PathWave ADS Core + EM Design + Layout + HSD Ckt Sim + SIPro + PIPro + FEM
W3627B includes post-layout verification for high-speed serial, and a highest accuracy EM simulation using the FEM simulator for 3D components like connectors.
W3627B includes post-layout verification for high-speed serial, and a highest accuracy EM simulation using the FEM simulator for 3D components like connectors.
Have Questions? We've Got Answers
Signal Integrity Pro is a high-speed digital design and analysis solution that helps engineers simulate, evaluate, and optimize signal quality across complex communication channels before hardware fabrication.
The solution is ideal for PCIe, USB, DDR, chiplet, data center, AI, and other high-speed digital applications where maintaining signal quality is critical for performance and compliance.
By identifying signal degradation mechanisms early through simulation and analysis, engineers can resolve issues before prototype fabrication, reducing redesigns, delays, and development costs.
Yes. The solution supports analysis of advanced chiplet interconnects and helps engineers evaluate signal integrity challenges associated with emerging chiplet architectures and standards.
Poor signal integrity can lead to degraded performance, reduced margins, compliance failures, and field reliability issues. Signal Integrity Pro helps engineers identify and mitigate these problems before production.