Discusses the design and implementation of the GlobalFoundries ADK integrated phased array on package, a wafer-level RF CSP. It covers topics such as the module's architecture, its materials and processes, and its performance.
×
Unlock Content
Sign up for free
*Indicates required field
Thank you.
Your form has been successfully submitted.
Note: Clearing your browser cache will reset your access. To regain access to the content, simply sign up again.