Discover four key principles for next-generation AI interconnect testing and the critical measurements needed to ensure reliable system performance. See how the new Fuunctional Interconnect Testing Solution (FITS) and automated lane turning with the DCA-M Sampling Oscilloscope improve signal integrity, BER and FEC validation, measurement consistency, and development speed.
October 7, 2026 10:00 AM CEST
October 22 2026 11:00 AM IST
November 12, 2026
Watch these new expert-led webinars on testing approaches for the physical layter through the network layer.
Learn how to validate AI network infrastructure by emulating real AI workloads and generating high-density traffic that mirrors GPU clusters. Test fabric performance at scale, catch issues earlier, and gain visibility from physical layer metrics to RoCEv2 traffic—so you can deploy AI infrastructure with confidence.
Explore the latest IEEE 802.3dj updates, new TDECQ and OMA definitions, and their impact on testing across pluggable, LPO, and CPO architectures. Learn how standards-aligned, automated validation workflows can help identify performance limits earlier and ensure reliable optical connectivity for next-generation AI networks.
Validate 1.6T Ethernet networks and components with AI workload emulation. Assess network performance with realistic traffic generation and protocol testing to ensure network reliability before and after deployment.
Solution Briefs
White Papers
White Papers
Delivers digital-layer bit error ratio (BER) and forward error correction (FEC) performance testing of high-speed optical and copper interconnects across up to 8 lanes simultaneously for reliable, automated benchmarking across the entire product life cycle.
Solution Briefs
White Papers
White Papers
Automate PHY and transceiver compliance to industry standards, including 224 Gb/s single-mode and multimode optics. Characterize performance to ensure reliability at the physical layer.
White Papers
Application Notes
Application Notes
Visually walk-through Keysight's latest emulation, validation, and testing solutions at 1.6T.
Keysight's Ram Periakaruppan, Vice President and General Manager discusses key challenges facing AI data centers.
White Papers
White Papers
Keysight and NTT Innovative Devices are working together to help shape the future of global communications. This alliance brings together deep technical expertise and advanced tools to overcome the toughest challenges in high-speed data transmission and move closer to next-generation optical interconnects for AI, cloud, and quantum computing.
Watch the video to see how the NTT and Keysight collaboration is replacing traditional electronic data transmission with photonics to power advanced AI systems and beyond.
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