Explore the EM Applications Center

Typical PathWave EM Design (EMPro) Users

IC Package Designers

The performance of an RFIC, monolithic microwave integrated circuits (MMIC), high-speed IC, or system-in-package (SIP) is directly impacted by the effects of packaging, including wire bonds and solder balls/bumps. Traditionally, designers had to draw and analyze packages in a separate, 3D EM tool and then laboriously import the results back to the IC or SIP circuit-design environment for a combined analysis. With EMPro, you can efficiently create 3D package structures that can be combined with 2D circuit layouts in Advanced Design System (ADS). This allows co-design of the IC, package, laminate, and module with circuit simulation and 3D EM simulation in a streamlined design flow. See our EM Applications Center.

Multilayer RF Module Designers

RF modules typically are constructed from multilayer ceramic or laminate dielectric material with embedded RF passive components between the layers. Such dielectric brick structures cannot be accurately solved by planar EM simulators, which assume infinite dielectric layers and do not account for edge proximity fringing. The embedded RF components are drawn by RF circuit layout macros which would be very time consuming to reproduce in a standalone 3D EM tool. Full 3D EM simulation integrated within the circuit design flow is the ideal solution for these applications. See our EM Applications Center.

RF & Microwave Component Designers

RF board designs include 3D components and connectors that need to be characterized to high frequencies. Component and connector designs created in other CAD tools can be imported into EMPro, and then simulated using either FEM or FDTD simulation technology.  High frequency components such as resonators are sensitive to interactions with the surrounding PC board traces and vias. Such 3D components can be created and simulated in EMPro and then combined with a board layout in ADS for complete 3D EM simulation using FEM technology. See our EM Applications Center.

Aerospace/Defense Industry Engineers

FDTD simulation has extremely high capacity and can handle large problems found in typical Aerospace/Defense applications. For example, FDTD can be used to optimize antenna placement in aircraft, or can be used to perform Radar Cross Section analysis.  Antenna designs can also be exported from EMPro to ADS in order to optimize matching circuitry design.  In ADS, link budget analysis and other system simulations can be performed.  FEM simulation technology in EMPro can be used to simulate RF components and IC packaging commonly found in Aerospace/Defense systems. See our EM Applications Center.

High-Speed Connector Designers

High-speed connector types such as SATA and HDMI now support Gbits/s data throughput. High frequency S-parameter models of connectors can be generated in EMPro and cross-verified with both the FEM and FDTD simulators to give designers twice the confidence in 3D EM simulation accuracy. The models can then be included in an ADS design kit that can be distributed and installed into ADS as a connector library for use in signal-integrity analysis and design of high-speed serial channels. See our EM Applications Center.

Antenna Designers

A critical design task in the development of cellular and networking products is maximizing antenna performance while minimizing antenna size. EMPro can simulate the antenna in realistic surroundings, including the phone components, housing and even the human hand and head. Compliance testing can also be performed, such as specific absorption ratio (SAR) and hearing aid compatibility (HAC). See our EM Applications Center.

Return to the PathWave EM Design (EMPro) page.