W9100E 3D Interconnect Designer - Standalone Version

• Comprehensive Interposer and Substrate Design: Design and simulate both silicon and organic interposers, enabling accurate modeling of advanced packaging and multi-die integration platforms.
• Detailed 3D Interconnect Modeling: Create detailed representations of complex interconnect structures, including: Microbumps, Redistribution layers (RDL), High-speed interconnect buses and Die-to-die connections. This enables accurate modeling of advanced heterogeneous integration architectures.
• Flexible Plane and Pattern Design: Supports flexible plane configurations with customizable patterns such as: Rectangular hatch structures and Diamond-shaped patterns. These structures help optimize signal integrity, routing density, and electrical performance.
• Automated Interconnect Routing: Built-in automated routing tools generate breakout feeds for via structures and interconnect paths, significantly reducing manual design effort and improving design productivity.
• Integrated Simulation Capabilities: Perform both component-level and interconnect-level simulations to validate performance early in the design process.
• Standards Support: Supports modern interconnect standards, including UCIe and BoW specifications, enabling engineers to design interoperable chiplet-based systems when required.

The 3D Interconnect Designer - Standalone Edition provides a dedicated environment for designing and simulating advanced three-dimensional interconnect structures used in modern semiconductor systems.

Engineers can define interposers, create detailed interconnect structures, route connections between dies, and validate signal behavior early in the design process.

The tool supports a wide range of advanced packaging and heterogeneous integration technologies, including chiplets, multi-die systems, and high-density interconnect architectures.

By enabling exploration and validation before detailed implementation, the standalone solution helps reduce design risk and accelerate development of next-generation electronic systems.