Simulation Software for AI/Data Center Infrastructure Design
Accelerate innovation across ICs, chiplets, packages, boards, optics, and system architectures powering next-generation AI and hyperscale data centers.
Analyze IR drop, ground bounce, electromagnetic interference, and power distribution behavior to ensure stable operation of AI accelerators, processors, and high-density server platforms.
Identify channel losses, crosstalk, reflections, and impedance discontinuities affecting multi-gigabit chiplet interconnects and advanced package communication pathways.
Perform electro-thermal co-simulation to predict hotspots, thermal coupling, and temperature-driven performance degradation in high-power data center devices.
Design and validate UCIe and BoW interfaces, ensuring interoperability, signal integrity, and reliable communication between chiplets in heterogeneous systems.
Create physically accurate models spanning chip, package, board, and system domains to analyze performance across the complete signal path.
Evaluate stacked die architectures, interposers, and advanced packaging technologies to improve performance, bandwidth density, and integration efficiency.
Design quantum devices, qubit control electronics, amplifiers, interconnects, and system architectures supporting scalable quantum computing infrastructure.
Design and simulate photonic integrated circuits for optical communication, high-bandwidth interconnects, and emerging data center technologies.
Bridge photonic device behavior with circuit and system performance to accelerate development of optical networking and compute architectures.
Simulate complete electrical-optical-electrical signal chains to optimize high-speed Ethernet modules, transceivers, and optical communication interfaces.
Design co-packaged optical solutions that reduce power consumption and bandwidth bottlenecks in next-generation AI and cloud computing platforms.
Model optical transmission systems and network architectures connecting hyperscale facilities while optimizing capacity, reach, latency, and signal quality.
Learn from Industry Experts
Accurate simulation prediction and mitigation requires full 3D EM simulation of the PCB power delivery network (PDN), end-to-end voltage regulator module (VRM) + PCB PDN, and dynamic load digital twin modeling. Other considerations include harmonic balance analysis for steady state transient nonlinear behavior, and careful separation of crosstalk and ground bounce noise sources. By integrating these techniques into the design process, engineers can significantly reduce the risk of late-stage failures, improve system reliability, and meet the stringent design requirements for designing AI, cloud computing, and advanced semiconductor architectures.
Blogs
Bootcamps
More Resources
eBooks
Power Integrity: The Foundation for Reliable Electronics Performance
White Paper
UCIe vs. BoW: Practical Insights for Choosing the Right Chiplet Standards
Applikationsberichte
Practical Modeling of 3D Interconnects with Hatched Ground Planes in Silicon Interposer Bridges, and Flex PCBs
WEBINARS
How To Design Advanced Package Interconnects Without Hatched Ground Simulation Bottlenecks
White Paper
Mitigating Signal Integrity Challenges in High-Speed Chiplet Designs
Applikationsberichte
AI-Assisted Automation for Advanced Packaging
Applikationsberichte
End-to-End Electrical-Optical-Electrical Flow in Keysight ADS
AI/Data Center Infrastructure FAQs
EDA software enables engineers to predict power, thermal, signal integrity, and system behavior before fabrication, reducing development risk and accelerating deployment.
Simulation tools optimize power delivery networks, package architectures, thermal performance, and high-speed interconnects required for modern AI workloads.
Power integrity analysis helps identify IR drop, voltage fluctuations, ground bounce, and EMI issues that affect reliability and performance.
As data rates increase, channel losses, crosstalk, reflections, and impedance discontinuities can significantly degrade system performance and reliability.
Chiplets improve scalability, yield, and performance by enabling heterogeneous integration while reducing development costs and accelerating innovation.
Electro-thermal simulation predicts how temperature impacts electrical performance, helping engineers mitigate hotspots and improve reliability.
Co-packaged optics shortens electrical interconnect distances, reduces power consumption, and enables higher bandwidth densities for AI and cloud systems.
Photonic technologies provide scalable bandwidth, lower latency, and improved power efficiency to support rapidly growing network traffic demands.
Yes. Full-stack simulation environments enable engineers to analyze interactions across dies, packages, PCBs, optics, and system-level architectures.
By enabling virtual prototyping, early verification, and cross-domain optimization, EDA tools help teams deliver advanced computing and networking technologies faster and with greater confidence.