How to Detect Post-Mold Wire Bond Defects

+ Electrical Structural Tester

Inspect Wire Bond Integrity Inline

Post-mold semiconductor inspection requires detecting physical wire bond defects that may not be identified by conventional open/short testing. Deformations such as wire sag, swept wires, and near-shorts can alter package integrity without producing measurable electrical opens or shorts, allowing defective devices to continue through production. The inspection process requires a non-destructive screening method capable of evaluating every device in high-volume manufacturing.

Electrical structural testing measures changes in the package's electrical characteristics to identify structural abnormalities after molding and before functional test. High-throughput inline screening, automated limit generation, and statistical outlier detection enable rapid identification of defective devices while integrating with automated handlers and manufacturing execution systems to support production-scale semiconductor assembly.

Post-Mold Wire Bond Inspection Solution

Post-mold wire bond inspection requires a high-throughput electrical screening system capable of detecting structural defects without damaging packaged devices. The Keysight Electrical Structural Tester uses Nano Vectorless Test Enhanced Performance (nVTEP) technology to identify electrical outliers associated with wire bond deformations, including near-shorts, sagged wires, and swept wires. The system supports parallel testing of multiple devices, automated test program generation, adaptive statistical algorithms such as Dynamic Part Averaging Test (DPAT), Real-time Part Averaging Test (RPAT), and Marginal Retry Test (MaRT), and automated limit generation using Known Good Units (KGUs). It integrates with strip and pick-and-place handlers and supports SECS/GEM communication for manufacturing execution system connectivity, enabling efficient inline deployment within high-volume semiconductor assembly lines.

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