On-Demand
In this webinar, we demonstrate how engineers can explore advanced interconnect designs earlier in the workflow, evaluate trade-offs more effectively, and reduce late-stage risk using our 3D Interconnect Designer product.
Engineers designing advanced packages, chiplets, or 3DIC interconnects, package designers working on interposer, substrate, or die-to-die connectivity, teams facing long simulation times or limited design exploration capability, engineers looking for a way to evaluate interconnect behavior earlier in the workflow.
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