The W5900E PathWave Thermal Design Core includes:
- Electrothermal solver works with your circuit simulator to provide temperature-aware simulation results
- High capacity: can handle large-scale analog/mixed-signal and digital IC designs
- High precision: provides accurate, device-level temperature data at sub-micron resolution
The W5900E PathWave Thermal Design Core covers both transient and steady-state thermal solvers that work with third-party circuit simulators, and a user-interface for visualizing 3D thermal results. The high-capacity transient solver enables temperature versus time analysis.
The PathWave Thermal Design IC thermal simulator for chips and stacked-die SiP computes the full-chip temperature profile at the spatial resolution of your devices and interconnect. It annotates profile data into your circuit simulator, making your simulation results temperature accurate. Because the geometric features of power sources and heat conduction paths inside a chip are at the submicron scale, the thermal modeling and numerical solution techniques have to be commensurate with such feature sizes. The simulation results are 3-dimensional temperature profiles with the necessary resolution and accuracy.
PathWave Thermal Design electro-thermal analysis software is available in two configurations; the preferred configuration depends on the type of analysis needed (steady-state versus transient thermal analyses) and the complexity of the design to be modeled (number of devices, e.g., transistors, that are to be modeled as heat / power sources).