백서
Automotive OEMs are increasingly venturing into chip design and manufacturing due to the criticality of semiconductors in vehicles. The semiconductor content in automobiles is expected to increase to nearly 50% by 2030, with power semiconductors accounting for 30% to 40% of EV semiconductor cost. In the WBG semiconductor landscape, chip manufacturers are vertically integrating into wafer/substrate manufacturing for supply security and quality control. With diverse stakeholders in the power electronics design landscape, there is a need for testing solutions that are easily scalable, highly modular, and flexible.
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