How To Detect Wire Bond Defects Using Capacitive-Based Electrical Structural Testing

+ Electrical Structural Tester

Screen Wire Bond Defects with High-Speed Capacitive Testing

Wire bond inspection requires identifying physical deformations that can compromise semiconductor device reliability after the assembly process. The inspection workflow must detect defects such as near-shorts, wire sagging, wire sweep, lifted wires, and missing or extra wires while ensuring consistent screening of every packaged device before functional testing.

The inspection process involves electrically screening each device to identify structural abnormalities caused by wire bond deformation. Reliable screening depends on non-destructive measurement, automated limit generation, statistical outlier detection, and high-throughput testing to support production-scale semiconductor manufacturing while improving defect coverage and screening efficiency.

High-Speed Electrical Structural Test for Wire Bond Screening

The Keysight Electrical Structural Tester uses Vectorless Test Enhanced Performance (nVTEP) technology to electrically detect wire bond deformations through capacitive sensing. By measuring changes in capacitive coupling while grounding all pins except the pin under test, the solution identifies structural defects such as near-shorts, wire sagging, wire sweep, lifted wires, extra or missing wires, and open connections. It supports parallel testing of up to 20 sites with test times as low as 0.9 seconds per site, while automated limit generation, statistical outlier detection, and seamless integration with automated handlers enable efficient, repeatable, and high-throughput inline screening for semiconductor manufacturing.

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