Webinar

Organic Bridge, Ceramic, or Silicon Interposer? Solving a 32 Gbps UCIe Design Challenge (Americas Session)

ic-semi-manufacturing semi-manufacturing EDA_Software Design_Engineering_Software

October 4, 2023

Date

10:00AM - 12:30 PM PT

Time

2 hours

Duration

Virtual

Location

Register Now

About this event

In this webinar you will learn how 3D Interconnect Designer helps engineers explore, simulate, and optimize different advanced-package architectures before detailed layout.

Who should attend this event?

Advanced packaging and 2.5D/3DIC engineers, Chiplet and UCIe designers and System architects evaluating package architectures.

October 4, 2023

Date

10:00AM PT

Time

90

Duration

Virtual

Location

Register Now