En savoir plus
segmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight :dtx/solutions/facets/industrie/semiconducteur,segmentation:funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation :product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:funnel/bofu,segmentation :product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight :dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation :campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation :funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight :dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation :business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight :dtx/solutions/facets/industry/semiconductor,segmentation:funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight :product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight :dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight :dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation :campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation :funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supplysegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,keysight:product-lines/1h,keysight :dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:funnel/bofu,segmentation:product-category/IC_Semi_Mfg,keysight:dtx/solutions/facets/design-and-test-product/power-supply
Comment effectuer des mesures de résistance
Les mesures de résistance nécessitent l'élimination des facteurs d'erreur, tels que la résistance résiduelle du cordon de test, la force électromotrice thermique et les courants de fuite sur le trajet de mesure. Découvrez comment résoudre ces problèmes de mesure à l'aide d'une fonction de détection à distance (connexion à 4 fils), d'une compensation de décalage et d'une fonction de garde.
En savoir plus