How to Design Multi-Technology mmWave Phased Arrays

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EDA Software
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EDA Software
+ EDA Software

Automating 3D multi-technology assembly at the wafer level

Integrating multiple chip technologies into a phased array design requires mapping each chip technology onto a 3D module assembly while reconciling connectivity, orientation, and interconnect parasitics. This process requires careful coordination and setup correlating design and embedding of key physical information.

To complete a multi-technology assembly, the engineer first sets up the base design, and then mounts additional components onto the module, each designed with its own technology, such as RFICs, MMICs, and laminates. The engineer must optimize the design by experimenting with the stacks and flipping components while retaining full model fidelity for electromagnetic (EM) and circuit co-simulation.

3D multi-technology layout solution for mmWave phased arrays

Automatic layout assembly of mixed technology components while preserving substrate integrity requires integrating multiple technologies into a mmWave phased array design. Keysight EDA Advanced Design System (ADS) incorporates a drag-and-drop tool (called SmartMount) that enables adding a component designed with one technology into a design using different technologies. The software minimizes errors caused by manual mapping methods, ensuring one-pass correct mount orientations and 3D interconnections. In a unified environment, Keysight EDA RFPro drives accurate EM / circuit co-simulation on any selected portion of the multi-technology design without requiring the engineer to add layout modifications or create temporary designs.
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