How to Improve Wire Bond Screening Yield

+ Electrical Structural Tester

Optimize Wire Bond Screening Limits

Post-mold wire bond screening requires measurements from Known Good Units (KGUs) to establish test limits that represent acceptable package structures. Capacitive measurements are collected across device-under-test pins and evaluated statistically to identify responses that deviate from the characterized population. Measurement outliers can indicate displaced wires or changes associated with sagging, sweeping, or other wire-bond deformation.

Adaptive statistical testing continuously evaluates production measurements against defined limits. Dynamic Part Averaging Test (DPAT) identifies abnormal variation using configurable statistical limits, while Real-time Part Averaging Test (RPAT) adjusts those limits as testing progresses. Marginal Retry Test (MaRT) applies one-sided hysteresis around test limits and immediately retests marginal measurements without replunging the device, reducing false failures from transient or borderline results.

Adaptive Wire Bond Screening Solution

Wire bond screening requires statistically established measurement limits that distinguish normal production variation from abnormal structural changes. The s8050 / Q3800A Electrical Structural Tester uses Nano Vectorless Test Enhanced Performance (nVTEP) capacitive measurements with Automated Limits Generation to establish limits from Known Good Units. Dynamic Part Averaging Test (DPAT) identifies statistical outliers, while Real-time Part Averaging Test (RPAT) continuously adjusts limits as production testing progresses. Marginal Retry Test (MaRT) adds a guard band around marginal results and enables immediate retesting without replunging the device. Together, these functions support adaptive screening while reducing false failures and identifying abnormal wire-bond variations.

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