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segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800asegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/80,segmentation:funnel/bofu,keysight:dtx/solutions/facets/design-and-test-product/board-test,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/q3/q3800a
Come individuare i difetti nei collegamenti a filo mediante prove strutturali elettriche basate sulla capacità
Esegue il controllo elettrico ad alta velocità dei collegamenti a filo per individuare difetti strutturali utilizzando misurazioni capacitive non distruttive, limiti automatici e rilevamento statistico dei valori anomali.
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