Choose a country or area to see content specific to your location
What are you looking for?
Bridging design and physical testing to evaluate drop, impact, shock, and vibration compliance before hardware exists.
Unlock your free upgrade to the next bandwidth tier.
Strengthen 1.6T network reliability for AI-scale workloads from transceivers to interconnects.
Pair Keysight VSA software with the new XA5 signal analyzer for advanced visualization, demodulation, and analysis — start your 30-day trial today.
With extra memory and storage, these enhanced NPBs run Keysight's AI security and performance monitoring software and AI stack.
Explore end-to-end workflows spanning IC design, validation, wafer test, and photonics.
Explore curated support plans, prioritized to keep you innovating at speed.
Achieve 200+ Gbaud multi-level modulated signals with high-speed AWGs for digital and optical standards.
Maximize accuracy and performance with precision accessories engineered for Keysight instruments.
Explore dual-channel and ultra-wideband signal analysis for demanding RF workflows.
Get faster, clearer insights with our new multicore, 12-bit oscilloscope up to 33 GHz. Trade in your old oscilloscope and get credit toward a new XR8.
Authoritative application notes, data sheets, reference designs, and test procedures to accelerate design and validation decisions.
Hands‑on bootcamps that teach system design, test methods, and production workflows engineers can apply immediately.
Success Stories
Quick access to support related self-help tasks.
Additional content to support your product needs.
Explore services to accelerate every step of your innovation journey.
Laser fault injection systems enable security engineers to perform highly targeted optical fault attacks by delivering controlled laser pulses to specific regions of a semiconductor device. By precisely manipulating device behavior during security-critical operations, these platforms help uncover vulnerabilities, assess the effectiveness of implemented countermeasures, and validate the resilience of modern embedded systems against advanced fault injection attacks.
Use optical imaging, positioning, and localization capabilities to focus attacks on precise locations within a chip.
Support advanced evaluation techniques, including multi-pulse and dual-laser attacks designed to challenge modern countermeasures.
Wavelength range
370 nm to 532 nm, 700 nm to 1100 nm
Additional features
3 objectives (optional); magnification 5x; 20x and 50x, 3 objectives; magnification 5x, 20x and 50x, X-axis movement resolution: 0.16 µm, Y-axis movement resolution: 0.32, NIR camera included
Product type
Fault injection laser system, Dual laser fault injection system, Fault injection laser microscope
Technology
Device Security
DS1101A
The DS1101A Fault Injection Laser System is an upgraded optical solution for the next generation of fault injection attacks.
Protecting chips against laser fault attacks is one of the main security challenges in the smart card industry. With the DS1101A Fault Injection Laser System, perform advanced laser fault attacks that meet the highest international standards to assess if a smart card is secured against laser attacks. The DS1101A offers a set of new features meeting the latest timing and power requests from fault injection experts around the world. The special set of lasers with dedicated optics and ultra-fast and flexible control create the ultimate fault injection test solution. Its integration with the Inspector software further ensures that automation and analysis are covered by extendible modules which are flexible and easy to use.
DS1102A
Reproduce a successful dual laser fault injection by generating two laser spots using the DS1102A Dual Laser Fault Injection System.
Countermeasures for fault injection are becoming more advanced. To bypass some of these countermeasures, a security evaluator needs to be able to generate multiple laser pulses at different locations. The DS1102A lets you generate two laser spots with independent location and timing.
DS1103A
The DS1103 is a cost-effective optical fault injection solution that works with Keysight and third-party laser sources.
The DS1103 mounts onto the DS1010A Precision XYZ Stage. It works with Keysight laser sources, Keysight diode lasers, DPSS lasers, and third-party lasers when a dovetail interface is available and the wavelength falls into the supported range.
Innovate at speed with curated support plans and prioritized response and turn-around times.
Get predictable, lease-based subscriptions and full lifecycle management solutions—so you reach your business goals faster.
Experience elevated service as a KeysightCare subscriber to get committed technical response and more.
Ensure your test system performs to specification and meets local and global standards.
Make measurements quickly with in-house, instructor-led training, and eLearning.
Download Keysight software or update your software to the newest version.
Laser fault injection (LFI) is a hardware security testing technique that uses highly controlled laser pulses to temporarily disturb the operation of a semiconductor device. By targeting specific regions of a chip during security-critical operations, engineers can induce faults and observe how the device responds. This helps identify vulnerabilities, validate countermeasures, and assess resistance against real-world fault attacks.
All three techniques introduce faults, but they differ in how the fault is delivered.
Because a laser can be focused on extremely small regions of a chip, it often provides greater spatial precision than other fault injection techniques.
Laser fault injection is commonly used to investigate:
The technique is particularly valuable when understanding how specific parts of a circuit behave under fault conditions.
Typically, yes. For laser fault injection, the chip package usually needs to be opened (decapsulated) so the laser has a clear optical path to the silicon. Depending on the device architecture and evaluation objectives, attacks may be performed from either the front side or the back side of the die.
A front-side attack targets the top surface of the semiconductor die, where metal layers and circuitry are accessible.
A back-side attack targets the chip through the silicon substrate from the back of the die. Back-side approaches are often used when metal layers on the front side obstruct access to security-critical circuitry.
The most appropriate method depends on the semiconductor technology and evaluation objective.
Different wavelengths interact differently with semiconductor materials and device structures.
Selecting the appropriate wavelength can help optimize:
Different semiconductor technologies, package types, and evaluation objectives may require different wavelengths to achieve the desired fault injection results.
A Dual Laser Fault Injection System enables two independent laser sources to be controlled within a single evaluation setup. This allows security engineers to perform advanced attack scenarios that may require multiple fault events at different locations or timings.
Some modern devices implement sophisticated countermeasures that may not be affected by a single fault event. A dual-laser setup can support more advanced evaluations by allowing faults to be introduced simultaneously or sequentially at different areas of the device.
Modern chips pack multiple functional blocks close together, and many countermeasures are designed to detect broad disturbances (like a whole-chip voltage glitch) but may be blind to a highly localized fault. Precise targeting lets evaluators test whether a specific piece of protected logic can be individually disturbed, the same technique a sophisticated attacker would use.
Yes. Keysight Laser Systems integrate with Inspector software to support test automation, campaign management, fault analysis, and repeatable security evaluations. Inspector can be used to control laser positioning, coordinate attack workflows, automate testing sequences, and manage evaluation results, helping security teams perform more efficient and reproducible fault injection campaigns.
While laser fault injection is one of the most advanced fault injection techniques available, modern laser systems and automation software make it increasingly accessible to evaluation laboratories, semiconductor companies, certification facilities, and product security teams. Organizations often begin with targeted vulnerability assessments and expand into more advanced attack scenarios as their security testing requirements evolve.