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webinar
October 4, 2023
Date
10:00AM - 12:30 PM PT
Time
2 hours
Duration
Virtual
会议简介
光子集成可提供更高的密度、更好的性能和更低的成本,从而为多太比特以太网的切换和通信、量子计算、激光雷达和生物传感应用提供支持。晶圆级进行快速、全面的高品质参数化测试,生成大量关于器件性能的数据,从而用于设计验证,减少进行大批量制造时选择合格裸片所花的时间。本期技术研讨会是德科技联合FormFactor的高级光学工程师袁博士将对硅光器件发展趋势及晶圆/芯片级测试方案做相关介绍。
会议日程
10:00AM PT
90
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