A wide range of GaAs, Si, SiGe and other process technologies.
Linux 64-bit OS platform.
When designing high power RFIC / MMIC components for products such as power amplifier modules, circuit simulation accuracy is dependent on having accurate device temperatures. Many transistor models now include self-heating models, but this does not take into account thermal coupling between devices, nor heat transfer through the die and packaging. This can lead to significant inaccuracies, especially in highly integrated designs where several power transistors are in close proximity. The ADS Electro-Thermal Analysis Solution provides accurate, “temperature aware” IC simulation results by using device temperatures that take into account thermal coupling, and thermal characteristics of the package.
The new thermal solver, highly tuned to RFIC / MMIC applications is available in ADS 2012. The solver runs a full 3D thermal analysis of the IC, utilizing power dissipation data from the ADS circuit simulator and device location information from the ADS layout design and material thermal properties from the process design kit (PDK). The thermal solver iterates with the circuit simulator, with the thermal solver providing updated temperatures to the circuit simulator, and then the circuit simulation providing updated power dissipation values to the thermal solver, until a converged solution is reached. The “temperature aware” circuit simulation results (e.g., gain, distortion levels) can be viewed in the ADS Data Display. A 3D viewer displays a dynamic temperature map of the IC.