Accessories

Features: 

• Provides connection to all (address, command, and control) and partial DQ (data signals) between a U4154B logic analysis system and JEDEC standard 96 ball DDR4 x16 DRAM (JEDEC MO-207 footprint variation DU-z)
• Provides observation of probed signals on industry-standard 96 ball DDR4 x16 DRAM and provides access for DDR Eye Scans of DDR4 signals
• Works with all solder finishes, and is designed to tolerate lead-free soldering temperature profiles
• Designed for smallest keep out volume (KOV) for a DDR4 x16 96 ball BGA interposer, and the two wing design allows capture of data rates up to and including 2400 Mb/s

Each W4636A requires: 

• One E5847A ZIF probe
• One U4154B logic analyzer module with Option 02G
• Three U4201A logic analyzer cables
• Chassis for U4154B logic analyzer(s) with controller or host PC

For more details, please contact your local Keysight Technologies sales representative.

The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.

For users who require access to all ADD/CMD/DQ/DQS at data rates over 2400Mb/s, the W4633A x4/x8 DDR4 BGA interposer and W4631A x16 DDR4 BGA interposers capture all ADD/CMD/DQ/DQS signals and are designed to capture data rates up to and including 3.2 Gb/s.

Features:

• Industry smallest DDR4 x4/x8 BGA interposer, designed to exceed 3.2 Gb/s data rates. (Provides connection to all (address, command, control and data) signals between a U4164A logic analysis system and JEDEC standard 78 ball DDR4 x4/x8 DRAM)
• Provides observation of data traffic on industry-standard 78-ball DDR4 x4/x8 DRAM and provides access for DDR eye scans and burst scans of DDR4 signals
• W4641A ships with a custom 78-ball DDR4 riser, required for keep-out volume (KOV) under the interposer (riser can be replaced with optional 3rd party socket – not provided)
• Works with all solder finishes and is designed to tolerate lead-free soldering temperature profiles
   

Each W4643A DDR4 x4/x8 BGA interposer requires

• U4164A logic analyzer module with Option -02G for quad sample state mode
• Chassis for U4164A logic analyzer module(s) with controller or host PC
• One U4208A probe/cable, 61-pin ZIF, from left wing, no RC, 160-pin direct connect to logic analyzer front panel connector AND one U4209A probe/cable, 61-pin ZIF, from right wing, no RC, 160-pin direct connect to logic analyzer front panel connector
• Default configuration obtained from B4661A memory analysis software standard tools installation (no charge for standard software tools and default configurations)
  
   

The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.

The W4643A DDR4 x4/x8 BGA interposer allows signal access to the DDR4 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM or can be installed with DDR4 78 ball riser (included) or an optional 3rd party socket (not provided) enabling operation and acquisition of high-speed DDR4 signals.

Features

• LPDDR3 178-ball BGA interposer designed to exceed 1866Mb/s data rates. Provides connection to all address, command, control, DQSt and DQ between a U4164A logic analysis system and JEDEC standard 178- ball LPDDR3 DRAM
• Provides access for DDR eye scans and burst scans of LPDDR3 signals
• W3301A ships with a custom 178-ball LPDDR3 riser to reduce keep-out volume (KOV) under the interposer. (Riser can be replaced with optional 3rd party socket – not provided)
• Works with all solder finishes and designed to tolerate lead-free soldering temperature profiles

Each W3301A LPDDR3 178-ball BGA interposer requires

• U4164A logic analyzer module with Option U4164A-01G or U4164A-02G to capture DQ at higher data rates
• Chassis for U4164A logic analyzer module(s) with controller or host PC
• Two E5406A Soft Touch Pro probes and four U4201A cables (160-pin connect to logic analyzer front panel connector)
• Default configuration obtained from B4661A memory analysis software standard tools installation(no charge for standard software tools and default configurations)

The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.

Features:

• Industry smallest DDR4 x16 BGA interposer, designed to exceed 3.2 Gb/s data rates. (Provides connection to all (address, command, control and data) signals between a U4164A logic analysis system and JEDEC standard 96-ball DDR4 x16 DRAM)
• Provides observation of data traffic on industry-standard 96-ball DDR4 x16 DRAM and access for DDR eye scans and burst scans of DDR4 signals
• W4641A ships with a custom 96-ball DDR4 riser, required for keep-out volume (KOV) under the interposer (riser can be replaced with optional 3rd party socket – not provided)
• Works with all solder finishes and is designed to tolerate lead-free soldering temperature profiles

Each W4641A DDR4 x16 BGA interposer requires

• U4164A logic analyzer module with Option -02G for quad sample state mode
• Chassis for U4164A logic analyzer module(s) with controller or host PC
• One U4208A probe/cable, 61-pin ZIF, from left wing, no RC, 160-pin direct connect to logic analyzer front panel connector AND one U4209A probe/cable, 61-pin ZIF, from right wing, no RC, 160-pin direct connect to logic analyzer front panel connector
• Default configuration obtained from B4661A memory analysis software standard tools installation (no charge for standard software tools and default configurations)
   

The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.

The W4641A DDR4 x16 BGA interposer allows signal access to the DDR4 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM or can be installed with DDR4 96-ball riser (included) or an optional 3rd party socket (not provided).

• Provides signal access points for DDR4 DRAM x4/x8 packages using JEDEC-standard common BGA footprints to the oscilloscope
• Perimeter solder-down test points can be used with Logic Analyzer flying leads or Oscilloscope solder-down probe tips to access signals
• Effective bandwidth may be extended with InfiniiSim Waveform Transformation software
• Measurement timing skews reduced by matched trace lengths from DDR4 balls to test points
• Probing compatibility with InfiniiMax probe, which includes E2677A, N5381A, and N5425A/N5426A differential solder-in probe heads
• S-parameter models are available for use with InfiniiSim for de-embedding purposes

The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.

The N2114A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
 

• Provides signal access points for DDR4 DRAM x16 packages using JEDEC-standard common BGA footprints to the oscilloscope
• Perimeter solder-down test points can be used with Logic Analyzer flying leads or Oscilloscope solder-down probe tips to access signals.
• Effective bandwidth may be extended with InfiniiSim Waveform Transformation software
• Measurement timing skews reduced by matched trace lengths from DDR4 balls to test points 
• Probing compatibility with InfiniiMax probe, which includes E2677A, N5381A, and N5425A/N5426A differential solder-in probe heads
• S-parameter models are available for use with InfiniiSim for de-embedding purposes 
  
• The N2115A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
  

The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.