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Keysight EEsof EDA Technical References
Keysight EEsof EDA recognizes that its users are some of the best and brightest engineers in the world. Take a look at some of the books and papers published that reference Keysight EEsof EDA products.
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Author(s) |
Papers & Articles, Published by... |
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![]() Plextek RFI |
Design of an X-Band GaN PA on UMS’ GH25 using Keysight ADS 2015 Plextek RFI |
![]() Plextek RFI |
Design of an X-Band GaN PA on UMS’ GH25 using Keysight ADS 2015 Plextek RFI |
Haq Nawaz |
IEEEXplore, August 2016 Microwave and Optical Technology Letters, July 2016
|
S. Theepak |
Mitigating Cavity/Enclosure Effects for RF Power Amplifiers Mitagating Cavity/Enclosure Effects for RF Power Amplifiers (PPTX Slides, 5.1 MB) India Keysight EEsof EDA Design Forum, June 2016 |
Andy Dearn |
Designing GaN MMIC PAs (PPTX Slides, 2.86 MB) Presented at Keysight Design Seminar, April 2016 in Surrey, UK |
![]() KU Leuven Technology |
Spherical Wave Based Macromodels for Efficient System-Level EMC Analysis in Circuit Simulators IEEE Transactions on Electromagnetic Compatibility, June 2016 |
![]() Picotest |
Fix poor capacitor, inductor, and DC/DC impedance measurements EDN Network, June 2016 |
![]() Univ. di Bologna (Italy) |
Iso-thermal and Iso-dynamic Direct Charge Function Characterization of GaN FET with Single Large-Signal Measurement (Slides, PDF, 2.10 MB) MTT-S IMS, May 2016 |
Mitsuharu Umekawa |
Importance of Switched-Mode Power Supply IC Model for Conductive EMI Noise Simulation ICEP 2016 Proceedings |
![]() Ericsson |
|
![]() CETC51 |
Use the time-domain feature of vector network analyzer on microwave switch trouble shooting |
![]() Univ. of Applied Sciences, Germany |
Implementation of a DC compact model for double-gate Tunnel-FET based on 2D calculations and application in circuit simulation |
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Nonlinear BAW filter model effects on the performance of an LTE receiver Ultrasonics Symposium (IUS), 2016 IEEE International |
![]() Institute for Electronics Engineering, University of Erlangen-Nuremberg |
Modeling nonlinear behavior of RF Bulk Acoustic Wave resonators Ultrasonics Symposium (IUS), 2016 IEEE International |
Jenshan Lin, Raul A. Chinga and Shuhei Yoshida (not pictured) |
Harmonically terminated high-power rectifier for wireless power transfer |
Prashant Singh, Guy A. E. Vandenbosch and Davy Pissoort (not pictured) |
Automated Line-Based Sequential Sampling and Modeling Algorithm for EMC Near-Field Scanning IEEE Transactions on Electromagnetic Compatibility, December 2016 |
Alexander Göritz, Matthias Wietstruck, Christian Wipf, Bernd Tillack, Andreas Mai, and Mehmet Kaynak (not pictured) |
Electromagnetic and small-signal modeling of an encapsulated RF-MEMS switch for D-band applications International Journal of Microwave and Wireless Technologies, February 2017 |
![]() Lamsim Enterprises, Inc. |
A Practical Method to Model Effective Permittivity and Phase Delay Due to Conductor Surface Roughness Practical Model of Conductor Surface Roughness Using Cubic Close-packing of Equal Spheres Practical Model for Conductor Surface Roughness Using Packing of Equal Spheres A Practical Method to Model Effective Permittivity and Phase Delay Due to Conductor Surface Roughness |
Dr. Mohammad S. Hashmi |
Exploring Fractional Order Elements for Single and Dual Band Impedance Matching for RF Applications IEEE SPCOM, June 2016 |
Peter Delos |
Phase Locked Loop Noise Transfer Functions High Frequency Electronics, June 2016 |
Philip Macphail |
Fitting a Simple Transformer Model to HFSS Simulation Results High Frequency Electronics, June 2016 |
Raphael Paulin |
MTT-S IMS, May 2016 |
Asuma Imamura Mitsuharu Umekawa |
Importance of Switched-Mode Power Supply IC Model for Conductive EMI Noise Simulation ICEP 2016 Proceedings |
Peter James Airbus Defence and Space |
Modelling of Multi-Port Amplifiers for Space Applications Presented in June 2016 at University of Manchester |
Anthony Tornambe STMicroelectronics |
FEM simulations of NFC certification tests in mobile phone environment
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Dr. Youn Sub Noh ETRI (Electronics and Telecommunications Research Institute) |
Presented in March 2016 at IEEE MWCL (Microwave and Wireless Components Letters)
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