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Why 1687?
Increasing demand for smaller and slimmer portable products with conscious focus to reduce power consumption is propelling more and more silicon Integrated Circuits (ICs) into squeezing multiple silicon dies or IPs (Intellectual Property) into a single IC package. To achieve this, in early 2000s semiconductor companies started packaging two-dimensional integrated circuit (2D IC) as Multiple Chip Modules (MCMs). Over the recent years, IC packaging has advanced into stacking different functional dies as a three-dimensional integrated circuit (3D IC). To this, the need for storing and processing more data has resulted into stacking multiple memory modules inside the IC package. Nowadays, performance centric applications like graphics use High Bandwidth Memory(HBM) into 3D for accelerating data access with lesser power consumption. All of this is a complex system residing in a Single IC package.
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