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애플리케이션 노트
Two approaches for determining the elastic modulus of thin ilms are compared by means of inite-element modeling. The irst approach, termed “substrate accounting,” applies an analytic model to substrateaffected modulus in order to determine and extract the inluence of the substrate, thus isolating the elastic modulus of the film. The second approach, termed “back extrapolation,” extrapolates substrateaffected modulus to zero penetration depth in order to determine ilm modulus at a position that is theoretically free of substrate inluence. If the ilm is mechanically uniform, then both approaches return ilm modulus with similar accuracy—within 2% for 0.2 < Ef/Es < 5. However, if the ilm has a “skin”—a thin supericial layer which is mechanically different from the rest of the ilm—then the substrate-accounting approach adds value, because it more clearly reveals the presence of the skin, and because it returns the modulus of the “bulk” of the ilm with better accuracy than the back-extrapolation approach.
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