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segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofusegmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:business-unit/EISG,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/power-supply,keysight:dtx/solutions/facets/workflow-stage/manufacturing,keysight:dtx/solutions/facets/industry/automotive,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:funnel/bofu
Comment réaliser le test LIV pour les dispositifs VCSEL ?
Les tests LIV pour les dispositifs VCSEL nécessitent un contrôle précis du courant d'injection et de la mesure de la puissance de sortie de la lumière pour créer la courbe LIV. Apprenez à réaliser des tests LIV à impulsions étroites pour vos dispositifs VCSEL dans différentes conditions de fonctionnement à l'aide d'une unité source/mesure.
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