W3606B PathWave ADS and EM design environments with 3D RF layout for RF module design and module level DRC/LVS/LVL verification for error-free assembly.


The W3606B PathWave ADS Core, EM Design, Layout, RFPro, RF Ckt Sim includes:

  • 3D RF layout for multi-technology RF module and packaging design
  • Module Level physical verification (DRC, LVS, LVL)
  • HB, Envelope, Transient/Convolution nonlinear circuit simulators
  • RFPro EM (Momentum and FEM) simulators
  • Error Vector Magnitude (EVM) optimization at circuit level
  • Comprehensive nonlinear stability analysis
  • EM Design enables the creation and import of parameterized 3D components into ADS

PathWave ADS bundle for multi-technology RF module physical design with module level verification (DRC, LVS, LVL) for error free assembly and 3D avoidance routing interconnections. RFPro EM simulators (Momentum and FEM) allows any selected electrical nets and components to be simulated without layout modifications or cookie cutting. Full suite of nonlinear circuit simulators enables RF modules to be designed for unconditional nonlinear stability, optimal modulated RF signal EVM performance at the circuit level. RFPro EM-circuit cosimulation ensures EM effects of packaging and interconnects are accounted for to achieve consistent design wins.

Critical Electrothermal Considerations

Electrothermal steady-state and transient simulation addresses electrothermal degradation of circuit performance such as:

  • AM-AM & AM-PM distortion leading to poor EVM & ACLR in modulated signals
  • Device impedance shift causing impedance mismatch, reduced efficiency and reliability
  • Thermal runaway failure from additive temperature rise when heat generated exceeds heat dissipated

Add the following elements to this bundle for electrothermal analysis:

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