As radio-frequency (RF) applications move into millimeter-wave (mmWave) frequencies, integration is becoming denser. This density increases the complexity of correctly assembling, simulating, and verifying multi-technology RF modules. Keysight PathWave Advanced Design System (ADS) helps reduce costly hardware failures by enabling intelligent integration of modules that interconnect circuit design softwares, including radio-frequency integrated circuits (RFIC), monolithic microwave integrated circuits (MMIC), laminate, wafer-level packaging, antennas, and printed circuit boards (PCBs) into dense 3D structures.

Signal Integrity for High-Speed Digital Design using Keysight ADS

Designing With Digitally Modulated Signals

RF circuits process digitally-modulated signals. They require error vector magnitude (EVM) as a figure of merit instead of the traditional P1dB or IP3 analog specifications. With PathWave ADS, you can simulate EVM at the circuit level for tuning and optimization. Then you can verify to industry wireless standards such as 5G, automotive radar, and WiGig by leveraging the signal-generation and processing algorithms leveraged from Keysight RF instrumentation.

Amplifier Stability Analysis

Tight integration in RF modules gives rise to unintended electromagnetic (EM) coupling and feedback loops in amplifiers that can cause instability, resulting in costly hardware failures.

PathWave ADS provides a rigorous and comprehensive amplifier-stability analysis capability. It replaces 14 traditional techniques to guarantee amplifier stability under all linear and nonlinear conditions. Combining stability analysis with EM-circuit co-simulation helps you locate and fix causes of instability before building hardware to achieve early design wins.

Power Integrity with High Speed Digital Design
Double Data Rate Memory (DDR) – Keysight

Multi-Technology RF Module Assembly for Em-Circuit Co-Simulation

PathWave ADS enables error-free assembly and 3D avoidance routing to interconnect RFICs, MMICs, laminates, wafer-level packaging, antennas, and PCBs into multi-technology RF modules.

RFPro then runs EM-circuit co-simulation on any portion of the RF module without modifying the 3D layout for tuning and optimization so you can perfect your design before building hardware. RFPro lets you use EM analysis as an interactive RF circuit design tool instead of a one-time verification tool to get to market faster.

Design RFIC and MMIC with Foundry Process Design Kits (PDK)

ADS is endorsed by leading Silicon and III-V foundries to enable the design of high performance RFICs and MMICs that must work when integrated in multi-technology RF modules which combine fan-out wafer level packaging (FOWLP), 3D interconnects, laminates and antennas.

Now RFICs and MMICs need not be designed in isolation, but proven within the final application such as 5G, automotive radars, or wireless networking, so that you can consistently achieve design wins with your customers.

Power Integrity with High Speed Digital Design

High Performance Computing (HPC) for EM and Circuit Simulation

Reduce simulation time by 80% for large designs that take hours to simulate. Use your own compute cluster or cloud compute service to run parallel jobs through an easy-to-use Design Cloud interface in ADS. Once launched, you can disconnect your local machine for other tasks and later reconnect to download finished results. HPC 1-pack makes it affordable to scale up parallelism as needed to thoroughly and quickly simulate/verify every aspect of your design before hardware production to avoid costly failures.

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