HMMC-5643 – 40 GHz Double Balanced Mixer
Data Sheets
Description
The HMMC-5643 is a double balanced ring–diode mixer capable of operation from 20 to 43.2 GHz on the LO, 20 to 40 GHz on the RF, and 0 to 20.7 GHz on the IF port. The design is optimized for maximum LO–RF isolation and good conversion efficiency over broad frequency ranges.
DC Specifications/Physical Properties
Symbol |
Parameters/conditions |
Min. |
Typ. |
Max. |
Units |
V(f)IF |
IF Port Voltage @ 200 µA DC, no LO Drive |
|
0.62 |
|
Volts |
RF Specifications
Symbol |
Parameters/conditions |
Min. |
Typ. |
Max. |
Units |
Ce_10ghz |
Conv.Loss, LO = 32 GHz, RF = 22 GHz, IF=10 GHz |
|
8.2 |
9.5 |
dB |
Ce_20.5ghz |
Conv.Loss, LO = 42.5 GHz, RF = 22 GHz, IF = 20.5 GHz |
|
8 |
9.5 |
dB |
Ce_2ghz |
Conv.Loss, LO = 32 GHz, RF = 30 GHz, IF = 2 GHz |
|
7 |
9.5 |
dB |
LO_IF30 |
L–I Isolation, LO = 30 GHz |
25 |
29 |
|
dB |
LO_IF40 |
L–I Isolation, LO = 40 GHz |
25 |
32 |
|
dB |
LO–RF |
LO–RF Isolation, LO 20 – 46 GHz, 16 dBm nominally |
|
40 |
|
dB |
LO–IF |
LO–IF Isolation, LO 20 – 46 GHz, 16 dBm nominally |
|
24 |
|
dB |
RF_IF22 |
RF–IF Isolation, LO 32 GHz, RF 22 GHz |
20 |
24 |
|
dB |
RF_IF30 |
RF–IF Isolation, LO 32 GHz, RF 30 GHz |
20 |
24 |
|
dB |
Spur12ghz |
2R–L Spur @ 12 GHz, L = 32 GHz, R = 22 GHz |
40 |
50 |
|
dBc |
Spur2ghz |
3R–2L Spur @ 2 GHz, L = 32 GHz, R = 22 GHz |
40 |
56 |
|
dBc |
Spur8ghz |
4R–3L Spur @ 8 GHz, L = 32 GHz, R = 22 GHz |
50 |
59 |
|
dBc |
Tempcox |
Conversion Loss Temperature Coefficient, LO = 32 GHz, RF = 30 GHz, IF = 2 GHz |
|
-0.0042 |
|
dB/°C |
Applications
The HMMC-5643 can be used in instrumentation, communications, radar, ECM, EW, and many other systems requiring frequency conversion. It can also be used for bi–phase modulation and phase detection.
Assembly Techniques
Die attach should be done with conductive epoxy. Gold thermosonic bonding is recommended for all bonds. The top and bottom metallization is gold.
GaAs MMICs are ESD sensitive. ESD preventive measures must be employed in all aspects of storage, handling, and assembly. MMIC ESD precautions, handling considerations, die attach and bonding methods are critical factors in successful GaAs MMIC performance and reliability.
Keysight application note #54, "GaAs MMIC ESD, Die Attach and Bonding Guidelines" provides basic information on these subjects.