HMMC-5635 50 GHz Frequency Doubler

Description

The HMMC-5635 is a passive diode frequency doubler. It is specified to operate with a 20–50 GHz output frequency. Conversion efficiency is usually around  -12 dB. The device has low 1/2 and 3/2 spurious output, typically 15 dBc or better. The doubler can be biased through on–chip resistors to allow operation at low input levels. Up to 22 dBm at the input can be accommodated. On–chip DC blocking capacitors are included at the input and output.

Applications

The HMMC-5635 frequency doubler is designed for use in microwave instrumentation source applications.

Operation

The HMMC-5635 is a passive diode doubler, with "+" and "-" DC bias pads included to optimize performance at low input power levels. Bias can be applied through either the "+" or "-" bias pad or both, with the other pad either grounded or open. The optimum bias will depend on frequency and input power level, and must be empirically optimized for each application.

DC blocking capacitors have been included at the input and output of the device for ease of interface to other devices. The device should be mounted using epoxy or solder to a metal case with thermal conductivity equal to, or better than, aluminum, and the case temperature should not exceed 85 °C. This will keep the diode junctions at or below 130 °C for an input power of 22 dBm, and will keep the rectified diode currents well within acceptable limits for reliable operation.

Assembly Techniques

Epoxy die–attach using conductive epoxy or solder die–attach using a fluxless AuSu solder preform can be used for assembly. Gold thermosonic wedge bonding with 0.7 mil diameter Au wire is recommended for all bonds. Tool force should be 22 ± 1 gram, stage temperature should be 150 ± 2 °C, and ultrasonic power and duration should be 64 ± 1 dB and 76 ± 8 msec, respectively. The bonding pad and chip backside metallization is gold.

RoHS Compliance

This part is RoHS compliant, meeting the requirements of the EU Restriction of Hazardous Substances Directive 2002/95/EC, commonly known as RoHS. Six substances are regulated: lead, mercury, cadmium, chromium VI (hexavalent chromium), polybrominated biphenyls (PBB), and polybrominated biphenyl ethers (PBDE). RoHS compliance requires that any residual concentration of these substances is below the Directive’s maximum concentration values (MCV): cadmium 100ppm by weight and all others 1000ppm by weight.

Moisture Compatibility

HMMC-5635 mold components in QFN are moisture-sensitive. The product is tested to the Moisture and Reflow Sensitivity Level 3 as per IPC/Jedec J-STD-020 and must be mounted within 168 hours of opening the shipping container. Store and handle parts for reflow and for rework per IPC/Jedec J-STD033B. An example of the moisture sensitivity label is shown Figure 1.

Tape and Reel

The HMMC-5635 is available in tape and reel format to facilitate automatic pick and place manufacturing. See Figure 7.

ESD and Handling Precautions

III-V MMICs are ESD sensitive. Damage from ESD events can significantly affect III-IV MMIC performance and reliability. Preventative ESD measures must be employed in all aspects of storage, handling, and assembly, in compliance with the Keysight ESD Control Program.  Information on the Keysight ESD Control Program can be found at: http://emg.communications.keysight.com/quality/esd/

For information on ESD precautions during die attach and bonding, please refer to Keysight application note #54, "III-V MMIC ESD, Die Attach and Bonding Guidelines" pub # 5991-3484.