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Electrical Structural Tester

Discover a nondestructive capacitive-based testing solution that accurately identifies defects in wire-bonded microelectronics.

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  • Test types

    Single Die Wire-Bonded Packages

  • System width

    700 mm to 1,430 mm

  • Maximum parallel testing

    4 to 20 sites

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Highlights

Innovative solutions for identifying wire bond defects

The Keysight electrical structural tester is a capacitive-based testing solution designed to identify wire bond defects accurately. Leveraging the advanced part average test (PAT) analysis, the tester establishes a baseline from known-good units to swiftly detect deviations like near-shorts, stray wires, wire sweeps, and sags within integrated circuits (ICs). This capability ensures robust product quality management and significantly enhances manufacturing efficiency. The electrical structural tester enables you to:

  • Test single-die wire bonded packages in singulated or strip-based form factor.
  • Achieve high-volume production with up to 20 parallel test sites, achieving up to 72,000 IC units per hour (UPH).
  • Enhance yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT) and real-time part averaging test (RPAT).

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