Beam Lead Attachment Methods for Beam Lead Devices
애플리케이션 노트
This application note gives the first time user a general description of various attachment methods for beam lead devices. The attached table summarizes the salient features of all the methods including the advantages, disadvantages, and the associated cost of the equipment. Equipment selection as dictated by the type of substrate being used is emphasized.
Handling
Beam lead devices can be attached by any of the conventional means, but matching the method to the intended substrate, conductor metals and finish is imperative to a reliable, cost effective process. The various methods should be evaluated in light of this requirement. A general setup for attaching beam leads is shown in Figure 1. Characteristics of the various methods are discussed below.