THe HeatWave IC thermal simulator for chips and stacked-die SiP computes the full-chip temperature profile at the spatial resolution of your devices and interconnect. It annotates this profile data into your circuit simulator, making your simulation results temperature accurate. Because the geometric features of power sources and heat conduction paths inside a chip are at the submicron scale, the thermal modeling and numerical solution techniques have to be commensurate with such feature sizes. The simulation results are 3-dimensional temperature profiles with the necessary resolution and accuracy.
- Electrothermal solver works with your circuit simulator to provide temperature-aware simulation results
- High capacity: can handle large-scale analog/mixed-signal and digital IC designs
- High precision: provides accurate, device-level temperature data at sub-micron resolution
HeatWave Electro-Thermal Anaysis Software is available in two configurations; the preferred configuration depends on the type of analysis needed (steady-state versus transient thermal analyses) and the complexity of the design to be modeled (number of devices, e.g., transistors, that are to be modeled as power sources).
The W2591ET HeatWave Steady-State Analog Electro-Thermal Simulator includes a steady-state thermal solver that works with third-party circuit simulators, and a user-interface for visualizing 3D thermal results. The steady-state thermal solver allows for transient circuit simulations, and produces average temperature results. The number of devices that can be modeled as power sources is limited to 50,000 in this configuration.
Data Sheets 2020.03.09
PathWave Thermal Design Temperature-Enabling Your Simulations